What is Rigid-Flex PCB?
Base Material: The most common material choice for the rigid layers is FR4, but other rigid materials like woven glass Polyimide can also be used.
Flexible Area: The flexible area is made of PI Kapton Polyimide material. The Cu is glued to the PI core material using mainly Acrylic or Polyimide adhesive (also called adhesive less).
Lines and spaces: Standard 100um minimum, advance down to 30um.
Vias: Rigid-Flex can contain PTH, blind vias, buried vias and Laser drilled micro-vias.
Layer Count: Up to24 layers
Surface Finish: ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Solder Mask: Liquid photo imageable Solder mask can be used in rigid areas. PI Coverlay or Flexible solder mask lacquer can be used in the flexible areas.
Multilayer Rigid-Flex Structure
Semi-Flex PCB Feature
|Semi-Flex PCB Feature||ICAPE Group Semi-Flex PCB technical specification|
|Layer count||Up to 16 layers with 2 layers at bending zone.|
|Technology highlights||Rigid PCB with deepth control milling to assume a bending zone (Max 2 layers). Cost effective option for flexible and static application.|
|Base Copper Thickness||From 1/2 Oz base to 1 Oz for bending zone. Up to 3+C53 Oz for rigid zonz.|
|Minimum track & spacing||0.075mm / 0.075mm|
|Surface finishes available||OSP, ENIG, ENEPIG, soft-Gold, Gold finger, immersion Tin, immersion silver|
|Minimum mechanical drill||0.15mm|
|PCB thickness||1,00 to 2,4mm.|
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