IC Substrate
New gen. of ultra HDI PCB

IC Substrate, like PCB (SLP), is pushing the boundaries between HDI PCB technology and IC substrate technology. SLP is an integrated part of the IC packaging or module used to connect the chip with the PCB motherboard. SLP Technology development is mainly driven by the mobile phone and wearable electronic device industries, and it is a rapidly growing market.

Product Benefits

The main functions of the IC substrate board include chip soldering and electrical connection by wire bonding or flip chip process, and it guarantees reliability by using adapted raw material for chip elongation.

High Density

Substrate Like PCB (SLP) brings HDI PCB production to a new level with ultra-fine line/space down to 30/30µm. Common roadmaps of the SLP Manufactories expect to reach line/space 20/20µm in 2024 and 10/10 in 2025.


Substrate Like PCB (SLP) is based upon BT (Bismaleimide Triazine) resin material instead of FR4. The BT material has a very high Tg. 250 to 300°C and a very low X&Y CTE 2-5 ppm/°C instead of 11-14 ppm/°C for FR4. This ensures very reliable integration with the IC substrates and creates the possibility to create Modules or Systems in Packages (SIP) with chips or components with high-density design.


SLP technology uses high-performance materials, the process of the IC Substrate and the stack-ups with laser defined vias known from HDI technology to create a very reliable and ultra complex HDI PCB.

What is IC Substrate PCB?


An IC substrate-like PCB (SLP), also known as an IC carrier board, is a type of printed circuit board that is specifically designed to hold integrated circuit (IC) chips. It is an ultra HDI PCB used in the semiconductor industry to package and connect IC chips to the rest of the electronic system.

The main function of an IC substrate PCB is to provide a physical platform for mounting and interconnecting the IC chips. The SLP typically has 2-6 layers of conductive traces, laser-defined vias, and pads that allow for electrical connections between both the IC chips and the PCB.


Line and space: 30/30µm (advanced 20/20µm)

Vias: 50µm Laser defined.

Layer count: 2 to 6

PCB material: BT resin, Bismaleimide Triazine


IC Substrate Structure

There are 3 different process methods.
Tenting – A subtractive process using thin start Cu foil of 9-12µm and production steps using panel plating. 35/35µm Line & Space possible.

mSAP – A modified semi-additive process using ultra-thin start Cu foil of 1,5µm and production steps using chemical Cu plating + pattern plating process and flash etching. 20/20µm Line & Space possible.

SAP – Semi-additive process using special material without base Cu. and production steps using chemical Cu plating + pattern plating process and flash etching. 15/15µm Line & Space possible. (The SAP method can create up to 12 layers, but it is only available for mass production.)

IC Substrate Stack-up and material

Stack-up like HDI PCB with core and PP
BT (Bismaleimide Triazine) resin material instead of FR4
BT it’s higher Tg. 250 to 300°C
BT it’s lower CTE XY axis 2-5ppm/°C instead of 11-14ppm/°C for FR4.
Limited to stack-up 2L, 4L, and 6L for standard and 1+2+1, 1+4+1, 2+2+2 for structure.

Do you need IC Substrate PCB's?

Double-sided and multilayer PCBs are commonly used in a wide range of electronic applications such as telecommunications, industrial control systems, and power supplies. They are also used in prototyping and small-scale production runs.

Technical Data

IC Substrate

HDI FeatureICAPE Group IC Substrate technical specification
Layer count2 to 6
Technology highlightsIC Substrate is PCB support for 1 Chip solder by Wire Bonding Process or Flip Chip Process
Materials BT (Bismaleimide Triazine)
Base Copper Thickness0-12um depending upon substrate structure method
Minimum track & spacing 30/30µm (Advanced 20/20µm)
Surface finishes available ENIG & ENEPIG
Minimum laser drill 50µm
Minimum mechanical drill 100µm
PCB thickness 2L min. 130µm, 4L min. 210µm, 6L min. 300µm

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