High-density

ICAPE offers a wide range of HDI structure and process to meet your PCB needs and brings you the better compromise between technology and cost.

Hover on the circuit board and click to see it in 360 °

What's a "HDI PCB’s"?

PCB’s with higher density than a normal pcb, line and space smaller than 120µ, via’s diameter smaller than 150µ and most of the time via’s made by laser technology

We also call them, sequential build up, build up board or microvia’s technology.

Why doing micro via's?

HDI board’s appears end of the 90s to follow component reduction size, absolutely no way to continue with 120µ tracks and 150µ diameter holes.

The top picture is 150µm microvia with 100 µm dielectric, the typical dimensions in the late 90s. In the middle 100 µm microvia with 60µm dielectric the typical design from early 2000. The bottom picture is today's 60µm microvia with 40µM dieletric.

What are the typical design value for HDI?

All Design and especially HDI design depend on material, application and furthermore on the supplier abilities! Anyway see below typical value for HDI boards.

3 methods to create µvias by laser ?

To create laser via's, there is at least 3 methods, all got advantages and disadvantages.

	Methods	Advantage / Disadvantage
Image+CO²	CO² burn the dielectric 350 hits per second	Very Fast Need an extra image process.(cost)
UV+CO²	UV take off the copper with helicoidale rotation CO² burn the dieletric 200 hits per second	Best actual compromise, speed / quality / cost
UV	Both Copper and dielectric are burn with the UV 80 hits per second	Flexible in term of technical capability But slow