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View ICAPE Rigid PCB Technical Specification and Capabilities
Enter only one .ZIP, or .7Zp, or .Tar, or .RAR, or .TGZ, or .Ace, or .Cab, or .LHZ file including printed circuit boards and stencil data.
Accepted data formats for PCB artwork are: Gerber (274D), or Gerber 274X (ou X1), or Gerber X2, or ODB++, or Eagle (Version XML du BRD).
PCB quantity
RaW Material / Tg Value i
PCB Thickness
Solder Mask Color
Via filling material
Extra prepregs
V-scoring
IPC
Mask color Legend
We have a large choice of PCB rigid materials. Please contact us for more information and a quote at marc.simonneau@icape.fr
| Brand Name | Type | Series | TG Value | |
|---|---|---|---|---|
| EMC | FR-4 | EM827 | 170 | Download specs PDF |
| EMC | FR-4 | EM825 | 150 | Download specs PDF |
| ITEQ | FR-4 | IT158 | 150 | Download specs PDF |
| ITEQ | FR-4 | IT180A | 170 | Download specs PDF |
| KING BOARD | FR-4 | KB-6167 | 170 | Download specs PDF |
| KING BOARD | FR-4 | KB-6165 | 150 | Download specs PDF |
| KING BOARD | FR-4 | KB-6160 | 130 | Download specs PDF |
| KING BOARD | FR-4 | KB-6160 | 170 | Download specs PDF |
| KING BOARD | FR-4 | KB-6160 | 150 | Download specs PDF |
| SHENG YI | FR-4 | S1000-2 | 170 | Download specs PDF |
| SHENG YI | FR-4 | S1600 | 130 | Download specs PDF |
| SHENG YI | FR-4 | S1141 | 140 | Download specs PDF |
| SHENG YI | FR-4 | S1141 | 130 | Download specs PDF |
| SHENG YI | FR-4 | S1141 | 150 | Download specs PDF |
| SHENG YI | FR-4 | S1000H | 150 | Download specs PDF |
| SHENG YI | FR-4 | S1000-2M | 180 | Download specs PDF |
| SHENG YI | FR-4 | S1000-2M | 170 | Download specs PDF |
| Brand Name | Type | Series | TG Value |
| Specification | Standard Capabilities | RFQ on request |
|---|---|---|
| Technology | Single side to 10 layers | Up to 48 layers |
| PCB minimum size by unit | 20 x 20 mm | Same |
| PCB minimum size on the routing panel | 10 x 10 mm | Same |
| Maximum size | 480 x 580 mm | Other sizes on request |
| Maximum area | 10 m2 | > 10m2 on request |
| Thickness | 0,8mm to 3,2mm | from 0,2 mm to 3,2 mm |
| Thickness tolerance | +/- 10% | +/- 8% |
| Outer Copper thickness | 18, 35, 70, 110, 140 µm | Same |
| Inner Copper thickness | 17, 35, 70, 105, 140, 175, 210 µm | Higher than 400 µm |
| Specification | Standard Capabilities | RFQ on request |
|---|---|---|
| Raw materials | FR4 TG up to 180°C | High Tg°, Rogers, Arlon, Teflon |
| UL approved materials | Yes | Yes |
| Finishing | OSP, HASL, LF-HASL, ENIG, Silver, Tin | Same |
| Solder mask vias | Yes | Same |
| Grooving | Yes | Grooving with jump |
| Multilayers special stack up | No | Yes |
| Drill diameter | 0.2 to 6.3 mm | < 0.2 mm |
| Track and space on inner layers | 100 µm | depend of copper base |
| Track and space on outer layers | 100 µm | depend of copper base |
| Monitored Impedance | Yes | Yes |
| Specification | Standard Capabilities | RFQ on request |
|---|---|---|
| CTI > 600V | Yes | Yes |
| Solder mask | Green, White, Black, Red, Blue, Yellow | Same |
| Silkscreen | 1 or 2 sides | Same |
| Colors | White, Black, Yellow | Red |
| Printed lines minimum width | 0.1 mm | 0.075 mm |
| Minimum space between lines | 0.1 mm | 0.075 mm |
| Peelable mask | < = 20% of total area | > 20% of total area |
| Carbon Silkscreen | Yes | Yes |
| Routing | Simple or Complex | Same |
| Routing tolerance | +/- 0,2 mm | +/- 0,1 mm |
X | Y |
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| Top | Bottom |
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| Left | Right |
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Circuit separation X |
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Circuit separation Y
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