Technical Days: technical training in the field of PCB and Technical Parts

A complete program of Technical Days to learn more about Printed Circuit Boards and Technical Parts!

TECHNICAL Days in Europe

ICAPE Group has been specialized in technical consulting and Printed Circuit Boards sourcing (PCBs) in Asia since 1999. Each year, lCAPE Group develops its organization and level of services in all areas.

As the European leader in its field, ICAPE Group is aware of its field development. In order to better serve and structure customer needs, ICAPE Group has recently integrated an adaptable technical support according to the interlocutor and the current market.

For several months, we have analyzed and structured the current market needs in terms of technical and general training in the field of PCB and Technical Parts. We have gathered and developed these needs with the help of our engineers, experts in PCBs and Technical Parts, in order to synthesize them in 7 themes discussed during our Technical Days.

Program

Single Sided and Polymer PCB
PCB Manufacturing Processes
Multilayer technologies and HDI
Flex and Flex-Rigid PCB
Products from CIPEM
Lighting and Power
Design to cost

These conferences are free of charge, and will be held in our conference center in Fontenay-aux-Roses, South of Paris.

Our Technical Days event can also be held in our Business Units all over the world or at our customers’ place. In general, lectures will be provided in English but could also be in French, depending on the audience.

Should you be interested, please email us at info@icape-group.com

Dates of Technical Days

Date	Place
October 16th 2018	France
July 24th 2018	France
March 13th-14th 2018	Slovenia
February 15th 2018	Italy
December 12th 2017	Brittany, France
December 8th 2017	Ile de France, France
October 18th 2017	Loire, France
October 3th 2017	Fontenay-aux-Roses, France
June 20th 2017	Toulouse, France
June 6th 2017	Germany

TECHNICAL Days in USA

ICAPE-DIVSYS also invites their customers in USA to spend a day with these Technical experts in Printed Circuit Boards and Assembly Processes. The day will feature three 45 minute Technical presentation, Tours, Lunch and snacks, and two workshops.

While the topics are technical in nature, they do not require a technical background. They are intended for participants from all disciplines from Purchasing to Quality.

We expect the workshops to be interactive, and invite customer participation with questions and comments.

We understand the busy schedules of all of our customers, so the presentations and workshops may be attended for the entire day, or just for topics of specific interest.

Program

Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements
Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross Ion Accumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract