了解印刷电路板和技术部件的完整技培訓!


自1999年以来,ICAPE集团一直专注于亚洲的技术咨询和印刷电路板(PCB)采购.ICAPE集团逐年发展其组织及其各个领域的服务水平。

作为该领域的欧洲领先企业,ICAPE集团深知其责任。 根据目前的市场情况,ICAPE集团最近整合了需求,为客户提供更好的技术支持。

几个月来,我们分析和构建了PCB和技术部件领域技术和一般培训方面的市场需求。 我们已将它们综合为7个关键主题/技术日,并将它们分发给我们的PCB和技术部门高级工程师专家。

程序

  • 单面和聚合物PCB
  • PCB制造工艺
  • 多层技术和HDI
  • 柔性和挠性刚性PCB
  • 西普產品
  • 照明和电力
  • 设计到成本

免费會議安排,并将在我们位于巴黎南部Fontenay-aux-Roses的会议中心举行。

我们的技术日活动也可以在我们遍布全球的业务部门或客户的地方举行。 总体而言,讲座将以英语提供,但也可能以法语提供,具体取决于观众。

如果您有兴趣,请发送电子邮件至 info@icape-group.com

Dates of Technical Days

Impedance Control

Date: 09/11/2022
Region: South Asia

Flex-Rigid

Date: 30/11/2022
Region: Poland

HDI

Date: 07/12/2022
Region: Mexico

Flex-Rigid

Date: 06/12/2022
Region: Europe

Flex-Rigid

Date: 08/12/2022
Region: France

Design to Cost

Date: 14/12/2022
Region: China



TechDays2017


TECHNICAL Days in USA

ICAPE-DIVSYS also invites their customers in USA to spend a day with these Technical experts in Printed Circuit Boards and Assembly Processes. The day will feature three 45 minute Technical presentation, Tours, Lunch and snacks, and two workshops.

While the topics are technical in nature, they do not require a technical background. They are intended for participants from all disciplines from Purchasing to Quality.

We expect the workshops to be interactive, and invite customer participation with questions and comments.

We understand the busy schedules of all of our customers, so the presentations and workshops may be attended for the entire day, or just for topics of specific interest.

Program

  • Laminates choices and Proper selection
  • Surface Finishes and their Applications and Limitations
  • Via Structures and their uses
  • Copper plating and Understanding thickness
  • Cleanliness understanding the terms and the implications
  • Why does the bare board and the assembly have the same standard?
  • Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
  • Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
  • Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
  • Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements
  • Cleanliness (ionic contamination, organic contamination and intermetallic growth)
  • Measurement Techniques for cleanliness (Gross Ion Accumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract


Dates of Technical Days

How solderability is influenced by the PCB surface finish?

Date: 10/11/2022
Region: USA