{"id":32947,"date":"2023-04-18T09:42:03","date_gmt":"2023-04-18T09:42:03","guid":{"rendered":"https:\/\/www.icape-group.com\/kretskort\/ic-substratkretskort\/"},"modified":"2025-11-10T21:21:47","modified_gmt":"2025-11-10T21:21:47","slug":"ic-substratkretskort","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/kretskort\/ic-substratkretskort\/","title":{"rendered":"IC-substratkretskort"},"content":{"rendered":"\t\t
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IC-substrat
Ny generation av ultra HDI-kretskort<\/span><\/span><\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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IC-substrat, liksom kretskort (SLP), flyttar fram gr\u00e4nserna mellan HDI kretskortsteknik och IC-substratsteknik. SLP \u00e4r en integrerad del av IC-f\u00f6rpackningen eller modulen som anv\u00e4nds f\u00f6r att ansluta chipet till kretskortsmoderkortet. SLP:s teknikutveckling drivs fr\u00e4mst av mobiltelefonindustrin och industrin f\u00f6r b\u00e4rbara elektroniska enheter, och det \u00e4r en snabbt v\u00e4xande marknad.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Produktf\u00f6rdelar<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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IC-substratkortets huvudfunktioner omfattar l\u00f6dning av chip och elektrisk anslutning genom tr\u00e5dbindning eller flip-chip-process, och det garanterar tillf\u00f6rlitlighet genom att anv\u00e4nda anpassat r\u00e5material f\u00f6r chipf\u00f6rl\u00e4ngning. Tillf\u00f6rlitligheten garanteras genom att anv\u00e4nda r\u00e5material som \u00e4r anpassade till de olika materialens t\u00f6jning under monteringsfaserna och klimatbegr\u00e4nsningarna.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n H\u00f6g densitet <\/h3>\n \t\t \t

Substratliknande kretskort (SLP) tar HDI-kretskortstillverkning till en ny niv\u00e5 med ultrafin linje\/rymd ner till 30\/30 \u00b5m. Enligt vanliga f\u00e4rdplaner f\u00f6r SLP Manufactories f\u00f6rv\u00e4ntas man n\u00e5 line\/space 20\/20\u00b5m \u00e5r 2024 och 10\/10 \u00e5r 2025. \n\n<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Substratliknande kretskort (SLP) baseras p\u00e5 BT-hartsmaterial (Bismaleimide Triazine) ist\u00e4llet f\u00f6r FR4. BT-materialet har en mycket h\u00f6g Tg. 250 till 300 \u00b0C och en mycket l\u00e5g X&Y CTE 2-5 ppm\/\u00b0C ist\u00e4llet f\u00f6r 11-14 ppm\/\u00b0C f\u00f6r FR4. Detta ger en mycket tillf\u00f6rlitlig integration med IC-substraten och g\u00f6r det m\u00f6jligt att skapa moduler eller SIP-system (Systems in Packages) med chip eller komponenter med h\u00f6g densitet.<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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SLP-tekniken anv\u00e4nder h\u00f6gpresterande material, processen f\u00f6r IC-substrat och de stack-ups med laserdefinierade vias som \u00e4r k\u00e4nda fr\u00e5n HDI-tekniken f\u00f6r att skapa ett mycket tillf\u00f6rlitligt och ultrakomplext HDI-kretskort.<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Vad \u00e4r IC-substratkretskort?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Definition<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ett IC-substratliknande kretskort (SLP), \u00e4ven kallat IC-h\u00e5llarkort, \u00e4r en typ av kretskort som \u00e4r s\u00e4rskilt utformat f\u00f6r att h\u00e5lla integrerade kretsar (IC). Det \u00e4r ett ultra HDI-kretskort som anv\u00e4nds inom halvledarindustrin f\u00f6r att paketera och ansluta IC-chip till resten av det elektroniska systemet.<\/p>\n

Huvudfunktionen f\u00f6r ett kretskort med IC-substrat \u00e4r att tillhandah\u00e5lla en fysisk plattform f\u00f6r montering och sammankoppling av IC-chip. SLP har vanligtvis 2-6 lager av ledande sp\u00e5r, laserdefinierade vias och kontaktytor som m\u00f6jligg\u00f6r elektriska anslutningar mellan b\u00e5de IC-chipen och kretskortet.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Specifikationer<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Linje och rymd:<\/strong> 30\/30 \u00b5m (avancerat 20\/20 \u00b5m)<\/p>\n

Vias:<\/strong> 50\u00b5m laserdefinierad.<\/p>\n

Antal lager:<\/strong> 2 till 6<\/p>\n

Kretskortmaterial:<\/strong> BT-harts, bismaleimidtriazin<\/p><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Struktur f\u00f6r IC-substrat<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Det finns 3 olika processmetoder.<\/strong><\/p>


Subtraktiv metod<\/span><\/strong> \u2013 subtraktiv process med tunna kopparpl\u00e5tar p\u00e5 9\u201312 \u00b5m och produktionssteg baserade p\u00e5 panel tenting-metoden<\/span>. 35\/35\u00b5m Line & Space m\u00f6jligt.<\/p>

mSAP<\/strong> \u2013 En modified semi additive process: en modifierad semiadditiv process med ett 1,5 \u00b5m tunt kopparblad, en kemisk kopparpl\u00e4tering + selektiv kopparbel\u00e4ggning och selektiv etsning<\/span>. 20\/20 \u00b5m Line & Space m\u00f6jligt.<\/p>

SAP<\/strong> \u2013 Semiadditiv process: en semiadditiv process med ett speciellt material utan kopparbas och en kemisk kopparpl\u00e4tering + selektiv kopparbel\u00e4ggning och selektiv etsning<\/span>. 15\/15 \u00b5m Line & Space m\u00f6jligt. (SAP-metoden kan skapa upp till 12 lager, men den \u00e4r endast tillg\u00e4nglig f\u00f6r masstillverkning.)<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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IC-substrat Stack-up och material <\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Stapling liknande HDI-kretskort med k\u00e4rna och PP. <\/span>
BT (Bismaleimide Triazine) hartsmaterial ist\u00e4llet f\u00f6r FR4
BT \u00e4r h\u00f6gre Tg. 250 till 300 \u00b0C
BT har l\u00e4gre CTE XY-axel 2-5ppm\/\u00b0C ist\u00e4llet f\u00f6r 11-14ppm\/\u00b0C f\u00f6r FR4.
Begr\u00e4nsat till stack-up 2L, 4L och 6L f\u00f6r standard och 1+2+1, 1+4+1, 2+2+2 f\u00f6r struktur.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Beh\u00f6ver du kretskort med IC-substrat?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Dubbelsidiga och flerlagers kretskort anv\u00e4nds ofta i en rad olika elektroniska till\u00e4mpningar som telekommunikation, industriella styrsystem och str\u00f6mf\u00f6rs\u00f6rjning. De anv\u00e4nds ocks\u00e5 f\u00f6r prototyper och sm\u00e5skalig produktion.<\/span><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Toppm\u00e4rken inom fordonsindustrin v\u00e4ljer ICAPE f\u00f6r att matcha och \u00f6vertr\u00e4ffa de h\u00f6ga kvalitets- och logistikkraven i deras bransch<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Ett st\u00e4ndigt \u00f6kande antal f\u00f6retag inom den medicinska industrin f\u00f6rlitar sig p\u00e5 precisionen fr\u00e5n ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Den industriella automationssektorn drar nytta av ICAPE:s intima f\u00f6rst\u00e5else av komplexiteten inom automation och robotteknik<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Fr\u00e5n det \u00f6gonblick d\u00e5 belysning b\u00f6rjade bli elektronisk har ICAPE:s ingenj\u00f6rer legat i framkant av den senaste utvecklingen och st\u00f6ttat design f\u00f6r massproduktion<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r elektrifierade v\u00e4rld gynnas av ICAPE:s tekniska expertis f\u00f6r att p\u00e5 ett s\u00e4kert s\u00e4tt m\u00f6jligg\u00f6ra de h\u00f6ga sp\u00e4nningar och str\u00f6mmar som transporterar v\u00e5r energi<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r elektrifierade v\u00e4rld gynnas av ICAPE:s tekniska expertis f\u00f6r att p\u00e5 ett s\u00e4kert s\u00e4tt m\u00f6jligg\u00f6ra de h\u00f6ga sp\u00e4nningar och str\u00f6mmar som transporterar v\u00e5r energi<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r \u00f6nskan att vara uppkopplade, alltid och \u00f6verallt, \u00e4r ryggraden i ICAPE:s tekniska kunnande och helhetsl\u00f6sningar<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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ICAPE:s ingenj\u00f6rer och specialister p\u00e5 leveranskedjor tillhandah\u00e5ller l\u00f6sningar som hj\u00e4lper \u00e4ven de mest trafikerade j\u00e4rnv\u00e4gsn\u00e4ten att h\u00e5lla sig p\u00e5 r\u00e4tt sp\u00e5r<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Anslut smarta n\u00e4tverk med intelligenta l\u00f6sningar fr\u00e5n ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Flyg<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t
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ICAPE Group v\u00e4xer inom flygindustrin tack vare f\u00f6rdelarna med v\u00e5ra experttj\u00e4nster och helhetsl\u00f6sningar.<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Tekniska data<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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IC-substrat<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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IC Substrat Funktion<\/th>ICAPE-gruppens tekniska specifikation f\u00f6r IC-substrat<\/th>\t\t\t\t<\/tr>\n\t\t\t<\/thead>\n\t\t\t\t\t\t
Antal lager<\/td>2 till 6 skikt<\/td><\/tr>
Tekniska h\u00f6jdpunkter<\/td>IC-substrat \u00e4r PCB-st\u00f6d f\u00f6r 1 Chip-l\u00f6dning genom Wire Bonding Process eller Flip Chip Process<\/td><\/tr>
Material och egenskaper<\/td>BT (Bismaleimid Triazin)<\/td><\/tr>
Bas koppar tjocklek<\/td>0-12um beroende p\u00e5 metod f\u00f6r substratstruktur<\/td><\/tr>
Minsta sp\u00e5r och avst\u00e5nd<\/td>30\/30 \u00b5m (avancerat 20\/20 \u00b5m)<\/td><\/tr>
Tillg\u00e4ngliga ytbehandlingar<\/td>ENIG & ENEPIG<\/td><\/tr>
Minsta laserborrning<\/td>50\u00b5m<\/td><\/tr>
Minsta mekaniska borrning<\/td>100\u00b5m<\/td><\/tr>
PCB-tjocklek<\/td>2L min. 130\u00b5m, 4L min. 210\u00b5m, 6L min. 300\u00b5m<\/td>\t\t\t\t<\/tr>\n\t\t\t<\/tbody>\n\t\t<\/table>\n\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Fr\u00e5gor?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Det finns ett ICAPE Group-team n\u00e4ra dig och ditt f\u00f6retag. V\u00e5ra aff\u00e4rsenheter runt om i v\u00e4rlden \u00e4r bemannade med lokala experter som kan svara p\u00e5 alla dina fr\u00e5gor.<\/p>\n

 Kontakta oss idag!<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\n\t\t\t\t\tKontakta oss<\/path><\/svg>\t\t\t\t<\/a>\n\t\t\t\t\t<\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

IC-substrat Ny generation av ultra HDI-kretskort IC-substrat, liksom kretskort (SLP), flyttar fram gr\u00e4nserna mellan HDI kretskortsteknik och IC-substratsteknik. SLP \u00e4r en integrerad del av IC-f\u00f6rpackningen eller modulen som anv\u00e4nds f\u00f6r att ansluta chipet till kretskortsmoderkortet. SLP:s teknikutveckling drivs fr\u00e4mst av mobiltelefonindustrin och industrin f\u00f6r b\u00e4rbara elektroniska enheter, och det \u00e4r en snabbt v\u00e4xande marknad. Kontakta […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":32408,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32947","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nIC SUBSTRATKRETSKORT | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Dubbelsidiga och flerlagers standardkretskort tillverkas huvudsakligen av FR4-material. 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