{"id":32942,"date":"2023-04-04T13:09:50","date_gmt":"2023-04-04T13:09:50","guid":{"rendered":"https:\/\/www.icape-group.com\/vetenskapen-kring-pcb\/tillverkningsprocess\/ytbehandling\/"},"modified":"2024-08-30T16:06:07","modified_gmt":"2024-08-30T16:06:07","slug":"ytbehandling","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/vetenskapen-kring-pcb\/ytbehandling\/","title":{"rendered":"Ytbehandling"},"content":{"rendered":"\t\t
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Ytbehandling<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Kretskortsresa 12:<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ytbehandling<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ytbehandling \u00e4r en bel\u00e4ggning mellan en komponent och ett obearbetat kretskort. Anv\u00e4nds huvudsakligen av tv\u00e5 sk\u00e4l: S\u00e4kerst\u00e4lla l\u00f6dbarheten under bestyckningsfasen och skydda kopparn fr\u00e5n oxidation.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - OSP<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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OSP st\u00e5r f\u00f6r Organic Solderability Preservative (Organiskt l\u00f6dbarhetsbevarande medel). Det \u00e4r en vattenbaserad ytbehandling. Korten \u00e4r milj\u00f6v\u00e4nliga och reng\u00f6rs innan de g\u00e5r igenom badet, vilket ger en utm\u00e4rkt plan yta. Denna snabba process kr\u00e4ver inte mycket utrustning, vilket g\u00f6r den till en kostnadseffektiv ytbehandling. OSP har kort h\u00e5llbarhet och kan vara k\u00e4nslig vid hantering. F\u00f6ljaktligen utf\u00f6rs fr\u00e4sningsprocessen f\u00f6re ytbehandlingen. Sammanfattningsvis \u00e4r en OSP-ytbehandling milj\u00f6v\u00e4nlig, ger en plan yta och \u00e4r en kostnadseffektiv l\u00f6sning som kan \u00e5teraktiveras Det finns ocks\u00e5 nackdelar som kort h\u00e5llbarhet, kan vara k\u00e4nslig vid hantering och denna ytbehandling kan exponera koppar vid slutmontering.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - BLYFRI HASL<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Blyfri HASL \u00e4r en f\u00f6rkortning f\u00f6r Hot Air Solder Levelin (utj\u00e4mning av l\u00f6dning med varmluft). det var en av de mest popul\u00e4ra ytbehandlingarna fram till f\u00f6r n\u00e5gra \u00e5r sedan. \u00c4ven om denna ytbehandling \u00e4r robust, \u00e4r det l\u00e5ga priset ocks\u00e5 kopplat till dess begr\u00e4nsningar. Under denna process genomg\u00e5r hela panelen mikroetsning f\u00f6r att reng\u00f6ras och f\u00e5r sedan en flussbel\u00e4ggning som g\u00f6r att ytbehandlingen f\u00e4ster b\u00e4ttre. D\u00e4refter doppas kortet i flytande tennlod och avl\u00e4gsnas med hj\u00e4lp av tv\u00e5 luftknivar som bl\u00e5ser varm tryckluft \u00f6ver kortets yta. Den blyfria l\u00f6sningen \u00e4r en obestridlig f\u00f6rdel f\u00f6r produkter med h\u00f6g tillf\u00f6rlitlighet. Men med allt fler HDI-kort ger denna process oj\u00e4mna ytor och \u00e4r inte l\u00e4mplig f\u00f6r komponenter med fin pitch. Sammanfattningsvis \u00e4r blyfri HASL-ytbehandling en allm\u00e4nt tillg\u00e4nglig teknik, en l\u00e5gkostnadsl\u00f6sning med god h\u00e5llbarhet. Det finns ocks\u00e5 nackdelar som att ytan kan vara oj\u00e4mn, att den inte \u00e4r l\u00e4mplig f\u00f6r komponenter med fin pitch och att processen kan inneb\u00e4ra en termisk p\u00e5frestning f\u00f6r korten.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - PENIG<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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ENIG st\u00e5r f\u00f6r Electroless Nickel Immersion Gold (pl\u00e4terad nickel neds\u00e4nkt guld). Denna process kr\u00e4ver att tejp t\u00e4cker kretsens konturer f\u00f6r att undvika \u00f6verdriven guldutf\u00e4llning och f\u00f6r att ENIG \u00e4r en dyr efterbehandlingsprocess. Panelen neds\u00e4nks i flera bad, f\u00f6rst elektrodeponeras ett lager p\u00e5 3-6 mikrometer nickel f\u00f6r att \u00f6ka vidh\u00e4ftningen. D\u00e4refter elektrodeponeras minst 0,05 mikrometer guld p\u00e5 panelen. En neds\u00e4nkt ytbehandling ger utm\u00e4rkt planhet och anv\u00e4ndningen av guld ger en stark l\u00f6dbarhet. Sammanfattningsvis \u00e4r ENIG-ytan idealisk f\u00f6r limning, har en stark l\u00f6dbarhet, ger en plan yta och har en god h\u00e5llbarhet. Det finns ocks\u00e5 nackdelar, fr\u00e4mst det faktum att denna yta \u00e4r en komplex process som inte \u00e4r en kostnadseffektiv l\u00f6sning.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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4 - H\u00c5RD GULDPL\u00c4TERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Vid h\u00e5rd guldpl\u00e4tering t\u00e4cks hela panelen av tejp. Endast den del som kr\u00e4ver applicering av en ytfinish tas bort. Till skillnad fr\u00e5n ENIG kan koppartjockleken i detta fall varieras genom att kontrollera hur l\u00e4nge pl\u00e4teringscykeln varar. Nickeln elektrodeponeras f\u00f6rst, sedan deponeras guldet enligt kundens \u00f6nskem\u00e5l. Guldtjockleken ger en utm\u00e4rkt h\u00e5llbarhet men \u00e4r ocks\u00e5 ett av de dyraste alternativen f\u00f6r ytbehandling. Sammanfattningsvis har h\u00e5rdguldpl\u00e4tering en ytfinish med mekaniska egenskaper, utm\u00e4rkt h\u00e5llbarhet och ger en plan yta. Det finns ocks\u00e5 nackdelar som h\u00f6ga kostnader, d\u00e5lig l\u00f6dbarhet och att processen \u00e4r komplicerad.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - NEDS\u00c4NKT TENN<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Neds\u00e4nkt tenn \u00e4r en metallisk ytbehandling.
Korten doppas i flera kemiska bad f\u00f6r att skapa b\u00e4sta m\u00f6jliga vidh\u00e4ftning f\u00f6r tenn. Neds\u00e4nkningen ger perfekt planhet och tenn skyddar den underliggande kopparn p\u00e5 b\u00e4sta s\u00e4tt. Det \u00e4r ett kostnadseffektivt alternativ, men den starka affiniteten mellan tenn och koppar kan leda till tr\u00e5dning av tenn.
Ytbehandling med neds\u00e4nkt tenn \u00e4r allm\u00e4nt tillg\u00e4nglig, ger en plan yta, \u00e4r en kostnadseffektiv l\u00f6sning, har god h\u00e5llbarhet och kan omarbetas.
Det finns ocks\u00e5 nackdelar som att omarbetningen \u00e4r begr\u00e4nsad, hanteringen kan vara k\u00e4nslig och det finns risk f\u00f6r tenntr\u00e5dning.
ICAPE Group efterfr\u00e5gar specifikt en h\u00f6gteknologisk slutprodukt i samarbete med tyskbaserade fabriker f\u00f6r att f\u00f6rverkliga neds\u00e4nkt tenn som motsvarar den tyska bilindustrins f\u00f6rv\u00e4ntningar.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Andra steg<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\t\t\t\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Ytbehandling Kretskortsresa 12: Ytbehandling Ytbehandling \u00e4r en bel\u00e4ggning mellan en komponent och ett obearbetat kretskort. Anv\u00e4nds huvudsakligen av tv\u00e5 sk\u00e4l: S\u00e4kerst\u00e4lla l\u00f6dbarheten under bestyckningsfasen och skydda kopparn fr\u00e5n oxidation. 1 – OSP OSP st\u00e5r f\u00f6r Organic Solderability Preservative (Organiskt l\u00f6dbarhetsbevarande medel). Det \u00e4r en vattenbaserad ytbehandling. Korten \u00e4r milj\u00f6v\u00e4nliga och reng\u00f6rs innan de g\u00e5r igenom […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":32713,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32942","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nTillverkningsprocess | ICAPE Group<\/title>\n<meta name=\"description\" content=\"ICAPE Groups ingenj\u00f6rer genomf\u00f6r en DFM-granskning (Design For Manufacturability), kontrollerar data, kopparlager, mekaniska ritningar, specifikationer...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"Tillverkningsprocess | ICAPE Group\" \/>\n<meta name=\"twitter:description\" 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