{"id":32911,"date":"2023-04-04T12:58:32","date_gmt":"2023-04-04T12:58:32","guid":{"rendered":"https:\/\/www.icape-group.com\/laminering\/"},"modified":"2024-08-30T15:53:48","modified_gmt":"2024-08-30T15:53:48","slug":"laminering","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/vetenskapen-kring-pcb\/laminering\/","title":{"rendered":"Laminering"},"content":{"rendered":"\t\t
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Laminering<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Kretskortsresa 4:<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Laminering<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Resan med kretskortet forts\u00e4tter i det fj\u00e4rde avsnittet av v\u00e5r videoserie. Hoppa ombord och uppt\u00e4ck lamineringssteget i tillverkningsprocessen f\u00f6r kretskort! Efter avbildningen av det inre lagret genomg\u00e5r korten registrering och laminering. F\u00f6lj med oss till v\u00e5r HDI-fabrik i Kina!<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - F\u00d6RBEREDELSE<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Panelerna tv\u00e4ttas f\u00f6r att avl\u00e4gsna den korroderade kopparytan samt eventuella fingeravtryck, torrfilmsrester, karbonat och antiskumrester fr\u00e5n torrfilmsborttagning.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - MIKROETSNING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Mikroetsning \u00e4r ett grundl\u00e4ggande villkor f\u00f6r att erh\u00e5lla en homogen och l\u00e4mplig brun- eller svartoxidbehandling. Processen kommer att minska koppartjockleken fr\u00e5n 0,2 till 1 mikrometer.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - PBLACK OXID<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Brun eller svart oxidbehandling anv\u00e4nds f\u00f6r att ge b\u00e4ttre vidh\u00e4ftning f\u00f6r epoxihartset och f\u00f6r att undvika problem som delaminering.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"lamination\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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4 - INRE LAGER STACK UP<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Operat\u00f6ren staplar innerlagret och pre-preg p\u00e5 limmaskinen, s\u00e5 att stapeln kan limmas ihop. N\u00e4r limningen \u00e4r klar g\u00e5r vi vidare till att anv\u00e4nda nitarna. Nitningsprocessen \u00e4r till f\u00f6r att slutf\u00f6ra registreringen och st\u00e4rka det inre lagret och pre-preg tillsammans. Detta st\u00e4rker stapeln och s\u00e4kerst\u00e4ller att den inte r\u00f6r sig under lamineringsprocessen.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - STACK UP<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Kopparfolien \u00e4r kl\u00e4md mellan en patch av rostfritt st\u00e5l och en pre-preg. Detta rostfria st\u00e5l skapar en h\u00e5rd och plan yta. Kopparfolien kompletterar stapeln. Panelen best\u00e5r nu upptill och nedtill av en kopparfolie och en pre-preg som omger det inre lagret.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"lamination\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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6 - LAMINERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Stapeln placeras under extrema temperaturer beroende p\u00e5 materialens datablad. Trycket i lamineringsmaskinen \u00e4r 180 ton per kvadratmeter och processen tar upp till 2 timmar. Efter att ha utsatts f\u00f6r h\u00f6gt tryck och h\u00f6ga temperaturer bildar lagren ett enda kort, som sedan flyttas till en kallpress. Senare avformas panelerna.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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7 - H\u00c5LREGISTRERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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De helt nya korten kommer att f\u00f6rberedas med registreringsh\u00e5len med hj\u00e4lp av en r\u00f6ntgenmaskin. De kommer sedan att avgradas, fasas och rundas i h\u00f6rnen.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Andra steg<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\t\t\t\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Laminering Kretskortsresa 4: Laminering Resan med kretskortet forts\u00e4tter i det fj\u00e4rde avsnittet av v\u00e5r videoserie. Hoppa ombord och uppt\u00e4ck lamineringssteget i tillverkningsprocessen f\u00f6r kretskort! Efter avbildningen av det inre lagret genomg\u00e5r korten registrering och laminering. F\u00f6lj med oss till v\u00e5r HDI-fabrik i Kina! 1 – F\u00d6RBEREDELSE Panelerna tv\u00e4ttas f\u00f6r att avl\u00e4gsna den korroderade kopparytan samt […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":32713,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32911","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nTillverkningsprocess | ICAPE Group<\/title>\n<meta name=\"description\" content=\"ICAPE Groups ingenj\u00f6rer genomf\u00f6r en DFM-granskning (Design For Manufacturability), kontrollerar data, kopparlager, mekaniska ritningar, specifikationer...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" 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