{"id":32909,"date":"2023-04-04T13:06:38","date_gmt":"2023-04-04T13:06:38","guid":{"rendered":"https:\/\/www.icape-group.com\/elektrolytisk-koppar\/"},"modified":"2024-08-30T15:58:27","modified_gmt":"2024-08-30T15:58:27","slug":"elektrolytisk-koppar","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/vetenskapen-kring-pcb\/tillverkningsprocess\/elektrolytisk-koppar\/","title":{"rendered":"Elektrolytisk koppar"},"content":{"rendered":"\t\t
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Elektrolytisk koppar<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Kretskortsresa 8:<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Elektrolytisk koppar<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Koppar kan deponeras elektrolytiskt p\u00e5 kortet med tv\u00e5 processer: Panel- och m\u00f6nsterprocess.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - PANELPL\u00c4TERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Kopparn deponeras elektrolytiskt \u00f6ver hela ytan samt inuti h\u00e5len f\u00f6r att f\u00f6rb\u00e4ttra planhet och distribution. Elektrolytisk koppar skapar elektrolys, vilket \u00e4r ett fl\u00f6de av elektrisk str\u00f6m genom en v\u00e4tska som orsakar kemiska f\u00f6r\u00e4ndringar. Efter flera bad om 3 min vardera skapas elektrolys, kopparn i badet fungerar som en anod och korten som en katod.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - KONTROLL<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Kopparn \u00e4r nu tjockare och mer tillf\u00f6rlitlig med cirka 10 till 13 mikrometer koppar. N\u00e4sta steg f\u00f6r korten kommer att vara Outer Layer Imaging (avbildning av det yttre lagret).<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - M\u00d6NTERPL\u00c4TERING \u2013 KOPPARDEPONERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Kopparn deponeras elektrolytiskt, men i mycket st\u00f6rre m\u00e4ngder. F\u00f6r att skapa en bra anslutning och en god ledningsf\u00f6rm\u00e5ga mellan h\u00e5len beh\u00f6ver korten minst 20 till 25 mikrometer koppar inuti v\u00e4ggh\u00e5len enligt IPC-standarderna. Kopparn, som fungerar som en anod, avs\u00e4tts p\u00e5 korten under ett 60 minuter l\u00e5ngt bad.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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4 - M\u00d6NTERPL\u00c4TERING \u2013 TENNDEPONERING<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Efter ett sk\u00f6ljbad doppas korten i det elektrolytiska tennet som t\u00e4cker all koppar med ett lager p\u00e5 cirka 1 till 3 mikrometer. Tennet \u00e4r n\u00f6dv\u00e4ndigt f\u00f6r att skydda kopparn under etsningsprocessen.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - KONTROLL<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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N\u00e4r de \u00e4r helt t\u00e4ckta testas de med en icke-f\u00f6rst\u00f6rande metod f\u00f6r att kontrollera lagrets tjocklek.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Andra steg<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Elektrolytisk koppar Kretskortsresa 8: Elektrolytisk koppar Koppar kan deponeras elektrolytiskt p\u00e5 kortet med tv\u00e5 processer: Panel- och m\u00f6nsterprocess. 1 – PANELPL\u00c4TERING Kopparn deponeras elektrolytiskt \u00f6ver hela ytan samt inuti h\u00e5len f\u00f6r att f\u00f6rb\u00e4ttra planhet och distribution. Elektrolytisk koppar skapar elektrolys, vilket \u00e4r ett fl\u00f6de av elektrisk str\u00f6m genom en v\u00e4tska som orsakar kemiska f\u00f6r\u00e4ndringar. Efter […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":32923,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32909","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nTillverkningsprocess | ICAPE Group<\/title>\n<meta name=\"description\" content=\"ICAPE Groups ingenj\u00f6rer genomf\u00f6r en DFM-granskning (Design For Manufacturability), kontrollerar data, kopparlager, mekaniska ritningar, specifikationer...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"Tillverkningsprocess | ICAPE Group\" \/>\n<meta name=\"twitter:description\" content=\"ICAPE Groups ingenj\u00f6rer genomf\u00f6r en DFM-granskning (Design 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