{"id":32707,"date":"2023-03-22T08:19:14","date_gmt":"2023-03-22T08:19:14","guid":{"rendered":"https:\/\/www.icape-group.com\/ytbehandling-for-kretskort\/"},"modified":"2024-04-30T20:01:40","modified_gmt":"2024-04-30T20:01:40","slug":"ytbehandling-for-kretskort","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/vetenskapen-kring-pcb\/ytbehandling-for-kretskort\/","title":{"rendered":"Ytbehandling f\u00f6r kretskort"},"content":{"rendered":"\t\t
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Ytbehandling f\u00f6r kretskort<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tYtbehandlingen p\u00e5 ett m\u00f6nsterkort skyddar kopparm\u00f6nstret fr\u00e5n oxidation och nedbrytning. Ytbehandlingen m\u00e5ste ge perfekt l\u00f6dbarhet n\u00e4r monteringskomponenterna placeras och svetsas p\u00e5 kortet. \n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Med mer \u00e4n 20 \u00e5r inom kretskortsindustrin har ICAPE Group utvecklat en gedigen kunskap om de olika typerna av ytbehandlingar. Med v\u00e5ra 27 partnerfabriker i Asien, Europa och Afrika kan ICAPE Group helt hantera och kontrollera alla steg i tillverkningsprocessen f\u00f6r kretskort, vilket garanterar fullst\u00e4ndig tillfredsst\u00e4llelse f\u00f6r v\u00e5ra \u00f6ver 3000 kunder \u00f6ver hela v\u00e4rlden.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Blyfri varmluftsl\u00f6dning utj\u00e4mning \u2013 LF HASL<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tPanelerna s\u00e4nks ned i ett bad av sm\u00e4lt tenn och \u00f6verskottet avl\u00e4gsnas med h\u00f6gtrycks varmluft (luftknivar) genom panelerna. Genom att s\u00e4nka ner kortet i ett s\u00e5dant hett bad kan man identifiera defekter eller skador innan komponenterna monteras. P\u00e5 grund av den h\u00f6ga densiteten ger denna process oj\u00e4mna ytor, kan skapa elektriska kortslutningar och \u00e4r inte l\u00e4mplig f\u00f6r komponenter med fin pitch. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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F\u00f6rdelar<\/b><\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Utm\u00e4rkt l\u00f6dbarhet
\n. Kostnadseffektivt
\n. Allm\u00e4nt tillg\u00e4nglig teknik<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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. M\u00f6jlig tjockleksskillnad p\u00e5 ytan
\n. Inte l\u00e4mplig f\u00f6r komponenter med fin pitch
\n. Abrasiv med koppar, beroende p\u00e5 legering
\n. Termisk belastning p\u00e5 kortet\n<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Neds\u00e4nkt tenn \n\t\t\t\t\t\t\t\t\t\t\t\t<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tNeds\u00e4nkt tenn eller ISn, \u00e4r en kemiskt deponerad ytbehandling som appliceras p\u00e5 kretskortets metallbas. Den typiska tjockleken p\u00e5 1\u00b5m ger denna bel\u00e4ggning en perfekt planhet men g\u00f6r den ocks\u00e5 mycket k\u00e4nslig. Koppar och tenn kan bilda ett intermetalliskt lager som f\u00f6rkortar h\u00e5llbarheten till 6 m\u00e5nader. I allm\u00e4nhet ger denna ytbehandling h\u00f6g tillf\u00f6rlitlighet och \u00e4r l\u00e4mplig f\u00f6r sm\u00e5 detaljer och sm\u00e5 komponenter. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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F\u00f6rdelar<\/b><\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Perfekt j\u00e4mnhet
\n. Inget bly anv\u00e4nds
\n. M\u00f6jlig omarbetning
\n. Toppval f\u00f6r presspassning<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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. K\u00e4nslig, kan skadas vid hantering
\n. Milj\u00f6problem med Thiourea som anv\u00e4nds i processen<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Neds\u00e4nkning Silver Ag \n\t\t\t\t\t\t\t\t\t\t\t\t<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tNeds\u00e4nkt silver \u00e4r en kemisk process som ger utm\u00e4rkt ytj\u00e4mnhet. Ytbehandlingens tjocklek varierar fr\u00e5n 0,12 till 0,40 \u00b5m och h\u00e5llbarheten \u00e4r 6 m\u00e5nader. Denna teknik kan svetsas med aluminiumtr\u00e5d, men den medf\u00f6r ocks\u00e5 begr\u00e4nsningar s\u00e5som k\u00e4nslighet f\u00f6r hantering, krav p\u00e5 specialf\u00f6rpackningar och begr\u00e4nsade m\u00f6jligheter f\u00f6r leveranskedjan att st\u00f6dja denna ytbehandling. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Utm\u00e4rkt planhet
\n. Perfekt f\u00f6r liten pitch och sm\u00e5 komponenter
\n. Konkurrenskraftigt pris
\n. Inget bly
\n. Omarbetning m\u00f6jligt
\n. Aluminiumtr\u00e5d som kan f\u00e4stas <\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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. K\u00e4nslig f\u00f6r hantering
\n. Minskade alternativ i leveranskedjan
\n. Kort intervall mellan operationer<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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ENIG \u2013 Electroless Nickel Immersion Gold (pl\u00e4terad nickel neds\u00e4nkt guld) \n\t\t\t\t\t\t\t\t\t\t\t\t<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tENIG \u00e4r en dubbellagers metallbel\u00e4ggning med nickel och guld. Det \u00e4r en barri\u00e4r f\u00f6r koppar och en yta d\u00e4r komponenterna l\u00f6das. D\u00e4refter appliceras 0,05 mikrometer rent guld p\u00e5 skivorna f\u00f6r att skydda nickeln under lagringstiden. Det \u00e4r en blyfri process som ger en mycket plan yta och utm\u00e4rkt l\u00f6dbarhet samt tillf\u00f6rlitlighet. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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F\u00f6rdelar<\/b><\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Plana ytor
\n. Stark l\u00f6dbarhet
\n. Bindningsv\u00e4nlig<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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. Ej kostnadseffektivt
\n. Pl\u00e4terad nickel\/fosfor kan ha o\u00f6nskade magnetiska egenskaper
\n. Aluminiumtr\u00e5d kan bindas, men inte guldtr\u00e5d
\n. Oxidering av nickel kan orsaka l\u00f6dfel <\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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ENEPIG \u2013 Electroless Nickel Electroless Palladium Immersion Gold (Pl\u00e4terad nickel Pl\u00e4terat palladium Neds\u00e4nkt guld) \n\t\t\t\t\t\t\t\t\t\t\t\t<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tProcessen \u00e4r densamma som f\u00f6r ENIG-ytbehandlingen. Men trots att ENIG \u00e4r en h\u00f6gkvalitativ ytbehandling kan nickeloxidation orsaka fel n\u00e4r komponenterna ska l\u00f6das fast p\u00e5 kortet. F\u00f6r att eliminera den risken kan man applicera ett palladiumlager mellan nickel och guld, vilket motverkar korrosion. L\u00f6dbarheten kan dock p\u00e5verkas om palladiumlagret \u00e4r f\u00f6r tjockt. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Plana ytor
\n. Stark l\u00f6dbarhet
\n. Bindningsv\u00e4nlig
\n. Palladiumlagret eliminerar potentiell korrosion fr\u00e5n neds\u00e4nkningsreaktionen<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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. Kostsam teknik
\n. Pl\u00e4terad nickel\/fosfor kan ha o\u00f6nskade magnetiska egenskaper
\n. L\u00f6dbarheten f\u00f6rs\u00e4mras p\u00e5 grund av f\u00f6r tjockt palladiumlager
\n. L\u00e5ngsammare att bli v\u00e5t<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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OSP - Organic Solderability Preservative (Organiskt l\u00f6dbarhetsbevarande medel) \n\t\t\t\t\t\t\t\t\t\t\t\t<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tOSP \u00e4r en vattenbaserad ytbehandling som appliceras i bad och vanligtvis anv\u00e4nds f\u00f6r kopparplattor. Denna organiska l\u00f6dmask binder till koppar och skyddar den mot korrosion. Detta \u00e4r dock inte den mest robusta finishen, och h\u00e5llbarheten \u00e4r kort. Denna process \u00e4r milj\u00f6v\u00e4nlig. \n\t\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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F\u00f6rdelar<\/b><\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Planhet
\n. Omarbetning m\u00f6jligt
\n. Rent och milj\u00f6v\u00e4nligt
\n. L\u00e5g kostnad<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Nackdelar<\/b><\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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. Begr\u00e4nsad h\u00e5llbarhetstid
\n. Begr\u00e4nsade termiska cykler
\n. Sv\u00e5rt att kontrollera
\n. Beg\u00e4r relativt aggressivt fl\u00f6de vid montering<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Fr\u00e5gor?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Det finns ett ICAPE Group-team n\u00e4ra dig och ditt f\u00f6retag. V\u00e5ra aff\u00e4rsenheter runt om i v\u00e4rlden \u00e4r bemannade med lokala experter som kan svara p\u00e5 alla dina fr\u00e5gor. Kontakta oss idag! <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\n\t\t\t\t\tKontakta oss<\/path><\/svg>\t\t\t\t<\/a>\n\t\t\t\t\t<\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Ytbehandling f\u00f6r kretskort Ytbehandlingen p\u00e5 ett m\u00f6nsterkort skyddar kopparm\u00f6nstret fr\u00e5n oxidation och nedbrytning. Ytbehandlingen m\u00e5ste ge perfekt l\u00f6dbarhet n\u00e4r monteringskomponenterna placeras och svetsas p\u00e5 kortet. Kontakta oss Tillg\u00e4ngliga alternativ Med mer \u00e4n 20 \u00e5r inom kretskortsindustrin har ICAPE Group utvecklat en gedigen kunskap om de olika typerna av ytbehandlingar. Med v\u00e5ra 27 partnerfabriker i Asien, […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":32713,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32707","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nYtbehandling f\u00f6r kretskort | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Ytbehandlingen p\u00e5 ett m\u00f6nsterkort skyddar kopparm\u00f6nstret fr\u00e5n oxidation och nedbrytning. 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