{"id":32378,"date":"2023-03-22T07:59:39","date_gmt":"2023-03-22T07:59:39","guid":{"rendered":"https:\/\/www.icape-group.com\/kretskortsdensitet\/"},"modified":"2025-01-21T09:34:33","modified_gmt":"2025-01-21T09:34:33","slug":"kretskortsdensitet","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/vetenskapen-kring-pcb\/kretskortsdensitet\/","title":{"rendered":"Kretskortsdensitet"},"content":{"rendered":"\t\t
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Kretskortsdensitet<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Densitet \u00e4r f\u00f6rh\u00e5llandet mellan sp\u00e5r, h\u00e5l och pads per ytenhet (mm\u00b2, tum\u00b2, etc…) N\u00e4r det bara finns ett f\u00e5tal sp\u00e5r \u00e4r densiteten inte ett problem. Men modern densitet kr\u00e4ver moderna l\u00f6sningar och varje dag efterfr\u00e5gar kunderna och fabrikerna mer kompakta och mer komplexa konstruktioner, fr\u00e4mst p\u00e5 grund av komponenttekniken. Ju h\u00f6gre densitet, desto mer komplext \u00e4r kretskortet. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Utmaningar f\u00f6r produktionen<\/span><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Med utvecklingen och miniatyriseringen av elektronik har efterfr\u00e5gan p\u00e5 HDI-kretskort \u00f6kat drastiskt, men att \u00f6ka densiteten p\u00e5 ett kretskort \u00e4r en utmaning fr\u00e5n design till produktion. Avst\u00e5ndet mellan sp\u00e5ren \u00e4r upp till 65 \u00b5m. HDI-kretskort tillverkas med minst 4 lager och kan ha upp till 24 lager, anslutna till varandra med h\u00e5l och vias f\u00f6r att skapa ultrakomplexa designregler och produktionsprocesser.<\/p>\n

Om konstruktionen \u00e4r en utmaning f\u00f6r ingenj\u00f6rerna med deras programvara, \u00e4r ett av de st\u00f6rsta problemen i produktionen att s\u00e4kerst\u00e4lla tillf\u00f6rlitligheten hos de pl\u00e4terade h\u00e5len. Det st\u00f6rsta problemet \u00e4r vias och h\u00e5l samt pl\u00e4teringsprocessen. F\u00f6r att anta en god h\u00e5lpl\u00e4teringsintegritet \u00e4r aspektf\u00f6rh\u00e5llandet begr\u00e4nsat till 1: 0,8 f\u00f6r blinda vias, avancerat v\u00e4rde \u00e4r 1:1. Standard pre-pregs inneh\u00e5ller ocks\u00e5 glasfiber som \u00e4r f\u00f6r tjockt f\u00f6r laserborrning. Glaset som finns i pre-preg \u00e4ndrar laserriktningen och skapar en medioker eller felaktig formkvalitet p\u00e5 laserh\u00e5len.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Huvudkapacitet <\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI<\/th>Kapacitet<\/th>\t\t\t\t<\/tr>\n\t\t\t<\/thead>\n\t\t\t\t\t\t
Antal lager
\nMIN & MAX<\/td>		4-24L\n<\/td><\/tr>
HDI-byggnader
1+N+1, 2+N+2<\/td>		3+N+3 och alla lager\n<\/td><\/tr>
Material
FR4, ..., ETC.<\/td>		Se tabell<\/td><\/tr>
Vikt koppar
MIN & MAX<\/td>		0,5oz~6oz\n<\/td><\/tr>
Minsta sp\u00e5r & mellanrum
MM<\/td>		65\/65\u03bcm\n<\/td><\/tr>
PCB-tjocklek
MIN & MAX<\/td>		0,4-2,8 mm\n<\/td><\/tr>
Dimension
MAX<\/td>		0,457*508 mm<\/td><\/tr>
Ytbehandling
OSEP, ENIG, ETC.<\/td>		HASL, HASL LF, ENIG, neds\u00e4nkning tenn, OSP, neds\u00e4nkning silver, elektropl\u00e4tering h\u00e5rt guld \/ mjukt guld, guldfinger, selektiv OSP, ENEPIG\n<\/td><\/tr>
Mekanisk borr
MIN<\/td>		0,15 mm<\/td><\/tr>
Laserborrning
MIN<\/td>		0,076 mm\n<\/td>\t\t\t\t<\/tr>\n\t\t\t<\/tbody>\n\t\t<\/table>\n\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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F\u00f6rb\u00e4ttrad PCB-design och tillf\u00f6rlitlighet f\u00f6r HDI<\/span><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\tUppbyggnaden m\u00e5ste anv\u00e4nda tunnare kopparbas f\u00f6r att f\u00e5 en bra sp\u00e5rdefinition. (m\u00e5nga pl\u00e4teringsprocesser \u00f6kar den totala koppartjockleken). Valet av kopparbas kan ocks\u00e5 p\u00e5verka signalspridningen f\u00f6r h\u00f6gfrekventa till\u00e4mpningar. Tunnare pre-preg, tunnare kopparbas, tunnare kretskort \u00e4r trenden f\u00f6r HDI-kretskort.\n\nVia-h\u00e5l \u00e4r k\u00e4nsliga. Vias \u00e4r som nitar under monteringsprocessen. RoHS-processer inneb\u00e4r en h\u00f6g termisk belastning p\u00e5 materialet och dessutom p\u00e5 vias. Materialets expansion i Z-axeln belastar vias. Trenden \u00e4r att kontinuerligt minska via-diametern och att \u00f6ka tillf\u00f6rlitligheten. Dessutom multiplicerar monteringsprocessen antalet termiska chocker. P\u00e5 grund av denna nya situation \u00e4r det enda s\u00e4ttet att minska kraften under monteringen att anv\u00e4nda mer stabil FR4. Material med l\u00e5g CTE (v\u00e4rmeutvidgningskoefficient) \u00e4r obligatoriska om vi vill begr\u00e4nsa fenomenet med h\u00e5l som g\u00e5r s\u00f6nder under monteringsprocessen och i tuffa milj\u00f6er. \n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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Fr\u00e5gor?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Det finns ett ICAPE Group-team n\u00e4ra dig och ditt f\u00f6retag. V\u00e5ra aff\u00e4rsenheter runt om i v\u00e4rlden \u00e4r bemannade med lokala experter som kan svara p\u00e5 alla dina fr\u00e5gor. Kontakta oss idag! <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\n\t\t\t\t\tKontakta oss<\/path><\/svg>\t\t\t\t<\/a>\n\t\t\t\t\t<\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Kretskortsdensitet Densitet \u00e4r f\u00f6rh\u00e5llandet mellan sp\u00e5r, h\u00e5l och pads per ytenhet (mm\u00b2, tum\u00b2, etc…) N\u00e4r det bara finns ett f\u00e5tal sp\u00e5r \u00e4r densiteten inte ett problem. Men modern densitet kr\u00e4ver moderna l\u00f6sningar och varje dag efterfr\u00e5gar kunderna och fabrikerna mer kompakta och mer komplexa konstruktioner, fr\u00e4mst p\u00e5 grund av komponenttekniken. Ju h\u00f6gre densitet, desto mer […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":32713,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32378","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nKretskortsdensitet | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Kretskortets densitet \u00e4r f\u00f6rh\u00e5llandet mellan sp\u00e5r, h\u00e5l och elektroder per ytenhet (mm\u00b2, tum\u00b2, etc...) N\u00e4r det bara finns ett f\u00e5tal sp\u00e5r \u00e4r densiteten inte ett problem.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"Kretskortsdensitet | ICAPE Group\" \/>\n<meta name=\"twitter:description\" content=\"Kretskortets densitet \u00e4r f\u00f6rh\u00e5llandet mellan sp\u00e5r, h\u00e5l och elektroder per ytenhet (mm\u00b2, tum\u00b2, etc...) N\u00e4r det bara finns ett f\u00e5tal sp\u00e5r \u00e4r densiteten inte ett problem.\" \/>\n<meta name=\"twitter:image\" content=\"https:\/\/www.icape-group.com\/wp-content\/uploads\/2023\/04\/ICAPE_RB_29554-Photoshopped.png\" \/>\n<meta name=\"twitter:label1\" content=\"Ber\u00e4knad l\u00e4stid\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minuter\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/sv\\\/vetenskapen-kring-pcb\\\/kretskortsdensitet\\\/\",\"url\":\"https:\\\/\\\/www.icape-group.com\\\/sv\\\/vetenskapen-kring-pcb\\\/kretskortsdensitet\\\/\",\"name\":\"Kretskortsdensitet | ICAPE Group\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/sv\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/sv\\\/vetenskapen-kring-pcb\\\/kretskortsdensitet\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/sv\\\/vetenskapen-kring-pcb\\\/kretskortsdensitet\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.icape-group.com\\\/wp-content\\\/uploads\\\/2023\\\/04\\\/ICAPE_RB_29554-Photoshopped-1024x683.png\",\"datePublished\":\"2023-03-22T07:59:39+00:00\",\"dateModified\":\"2025-01-21T09:34:33+00:00\",\"description\":\"Kretskortets densitet \u00e4r f\u00f6rh\u00e5llandet mellan sp\u00e5r, h\u00e5l och elektroder per ytenhet (mm\u00b2, tum\u00b2, etc...) 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