{"id":32162,"date":"2023-02-28T20:13:50","date_gmt":"2023-02-28T20:13:50","guid":{"rendered":"https:\/\/www.icape-group.com\/hdi\/"},"modified":"2025-02-17T16:36:54","modified_gmt":"2025-02-17T16:36:54","slug":"hdi","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/sv\/kretskort\/hdi\/","title":{"rendered":"HDI"},"content":{"rendered":"\t\t
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HDI PCB
Mindre, snabbare, t\u00e4tarer<\/span><\/span><\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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High-Density Interconnect, HDI PCB, anv\u00e4nder mikro-vias och mindre sp\u00e5rutrymme f\u00f6r att ge h\u00f6gre signaldensitet och \u00f6verl\u00e4gsen signalintegritet. Det m\u00f6jligg\u00f6r sammankoppling av paket med l\u00e5g pitch och mycket h\u00f6gre komponentt\u00e4thet.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Produktf\u00f6rdelar<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI f\u00f6rb\u00e4ttrar fan out och minskar l\u00e4ngden p\u00e5 signalv\u00e4gen. HDI tar bort via-stubbar, minskar signalreflexer och f\u00f6rb\u00e4ttrar d\u00e4rmed signalkvaliteten. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n B\u00e4ttre signalintegritet <\/h3>\n \t\t \t

HDI hj\u00e4lper till att placera komponenterna n\u00e4rmare varandra, vilket minskar l\u00e4ngden p\u00e5 signalv\u00e4gen. HDI tar bort via-stubbar, minskar signalreflexer och f\u00f6rb\u00e4ttrar d\u00e4rmed signalkvaliteten.\n\n\n\n<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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\n H\u00f6g tillf\u00f6rlitlighet <\/h3>\n \t\t \t

Laserborrade mikro-vias har mindre risk f\u00f6r tillverkningsfel och sammankopplingsdefekter under PCB-produktionen j\u00e4mf\u00f6rt med konventionella via PTH (pl\u00e4terade genomg\u00e5ende h\u00e5l). Mikro-vias p\u00e5verkas ocks\u00e5 mindre av CTE (v\u00e4rmeutvidgningskoefficient) under monteringsprocessen. <\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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\u00c4ven om kvadratmeterpriset \u00e4r h\u00f6gre f\u00f6r HDI PCB, g\u00f6r den \u00f6verl\u00e4gsna signalintegriteten, h\u00f6gre tillf\u00f6rlitligheten och utrymmes-, vikt- och lagerbesparingar HDI PCB till en kostnadseffektiv kvalitetsl\u00f6sning. <\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Vad \u00e4r HDI PCB?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Definition<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI – High-Density Interconnect (Interkonnektivitet med h\u00f6g densitet). Det finns m\u00e5nga olika definitioner av HDI-teknik. Gemensamt f\u00f6r alla HDI-kort \u00e4r anv\u00e4ndningen av mindre sp\u00e5rvidd och mikro-vias f\u00f6r att skapa h\u00f6gre kabeldragningsdensitet \u00e4n ett konventionellt kretskort. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Specifikationer<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Linje och rymd:<\/strong> HDI-kretskort har vanligtvis mindre sp\u00e5r- och avst\u00e5ndsbredder med storlekar s\u00e5 sm\u00e5 som 0,002, 0,003 eller 0,004 tum (50, 75, 100 mikron). De flesta tillverkare anv\u00e4nder laser direct imaging (LDI) och vakuumlinjer av typen Develop-Etch-Strip (DES) f\u00f6r att etsa fina m\u00f6nster.<\/p>\n

Vias:<\/strong> Laserborrade mikro-vias och begravda vias anv\u00e4nds f\u00f6r att \u00f6ka antalet sammankopplingar som kr\u00e4vs f\u00f6r modern low-pitch BGA-komponentt\u00e4thet.<\/p>\n

Antal lager:<\/strong> Minskat lageravst\u00e5nd som anv\u00e4nds i de flesta HDI PCB hj\u00e4lper till att minska PCB-tjockleken och vikten p\u00e5 slutprodukten.<\/p>\n

Kretskortmaterial:<\/strong> Vi rekommenderar vanligtvis medelh\u00f6gt eller h\u00f6gt Tg. material f\u00f6r HDI PCB. M\u00e5nga till\u00e4mpningar med kontrollerade sp\u00e5rimpedanser kr\u00e4ver speciella h\u00f6ghastighetsmaterial med l\u00e5g avledningsfaktor (Df) och l\u00e5g relativ dielektricitetskonstant (\u03b5r Dk)<\/p>\n

Ytbehandling:<\/strong> F\u00f6r montering av ett HDI-kretskort kr\u00e4vs en plan l\u00f6dpunktsyta med god l\u00f6dbarhet. De vanligaste ytbehandlingarna \u00e4r OSP ENIG, ENEPIG och Immersion Sn.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Beh\u00f6ver du HDI PCB?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI \u00e4r en n\u00f6dv\u00e4ndighet n\u00e4r komponentens pitch kr\u00e4ver det, eller kortets storlek kr\u00e4ver det. Med r\u00e4tt design \u00e4r HDI-kretskort mindre, tunnare och v\u00e4ger mindre (trenden \u00e4r ”downsizing”). HDI har en m\u00e4ngd olika konstruktioner och variabler som alla p\u00e5verkar densiteten. F\u00f6r att f\u00f6rst\u00e5 hur blind vias, skip vias, staggered vias, stacked vias och blinda vias bidrar till densiteten m\u00e5ste du g\u00f6ra ett ”routingtest” och leka med alla dessa olika stack-ups och konstruktioner. Genom att m\u00e4ta m\u00e5tten (tum\/kvadrattum och stift\/kvadrattum) kan du skapa en tabell som relaterar dessa densitetsm\u00e5tt till motsvarande konstruktion.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Toppm\u00e4rken inom fordonsindustrin v\u00e4ljer ICAPE f\u00f6r att matcha och \u00f6vertr\u00e4ffa de h\u00f6ga kvalitets- och logistikkraven i deras bransch<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Ett st\u00e4ndigt \u00f6kande antal f\u00f6retag inom den medicinska industrin f\u00f6rlitar sig p\u00e5 precisionen fr\u00e5n ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Kunder inom konsument- och multimediaindustrin drar nytta av v\u00e5r h\u00f6ga kvalitet och omfattande kunskap om elektronik.<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Den industriella automationssektorn drar nytta av ICAPE:s intima f\u00f6rst\u00e5else av komplexiteten inom automation och robotteknik<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Fr\u00e5n det \u00f6gonblick d\u00e5 belysning b\u00f6rjade bli elektronisk har ICAPE:s ingenj\u00f6rer legat i framkant av den senaste utvecklingen och st\u00f6ttat design f\u00f6r massproduktion<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r elektrifierade v\u00e4rld gynnas av ICAPE:s tekniska expertis f\u00f6r att p\u00e5 ett s\u00e4kert s\u00e4tt m\u00f6jligg\u00f6ra de h\u00f6ga sp\u00e4nningar och str\u00f6mmar som transporterar v\u00e5r energi<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r elektrifierade v\u00e4rld gynnas av ICAPE:s tekniska expertis f\u00f6r att p\u00e5 ett s\u00e4kert s\u00e4tt m\u00f6jligg\u00f6ra de h\u00f6ga sp\u00e4nningar och str\u00f6mmar som transporterar v\u00e5r energi<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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V\u00e5r \u00f6nskan att vara uppkopplade, alltid och \u00f6verallt, \u00e4r ryggraden i ICAPE:s tekniska kunnande och helhetsl\u00f6sningar<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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ICAPE:s ingenj\u00f6rer och specialister p\u00e5 leveranskedjor tillhandah\u00e5ller l\u00f6sningar som hj\u00e4lper \u00e4ven de mest trafikerade j\u00e4rnv\u00e4gsn\u00e4ten att h\u00e5lla sig p\u00e5 r\u00e4tt sp\u00e5r<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Anslut smarta n\u00e4tverk med intelligenta l\u00f6sningar fr\u00e5n ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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ICAPE Group v\u00e4xer inom flygindustrin tack vare f\u00f6rdelarna med v\u00e5ra experttj\u00e4nster och helhetsl\u00f6sningar.<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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HDI PCB-designtekniker anv\u00e4nds n\u00e4r man \u00f6verv\u00e4ger behovet av att montera extrem komponentdensitet p\u00e5 en begr\u00e4nsad kortstorlek. Komponentt\u00e4theten avg\u00f6r antalet anslutningar per kvadrattum p\u00e5 kortet. Om anslutningarna av alla delar och testpunkter dividerat med kortets storlek \u00e4r mindre \u00e4n 120 – 130 stift per kvadrattum finns det ingen anledning att anv\u00e4nda HDI, s\u00e5vida inte anv\u00e4ndningen av specifika t\u00e4ta BGA kr\u00e4ver HDI f\u00f6r att underl\u00e4tta alla anslutningar. HDI-tekniken har revolutionerat elektronikindustrin och anv\u00e4nds i de flesta elektronikprylar du k\u00e4nner till. Efterfr\u00e5gan p\u00e5 kretskort med HDI-teknik ser lovande ut f\u00f6r m\u00e5nga olika branscher.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Tekniska data<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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HDI-funktion<\/th>ICAPE-gruppens tekniska specifikation f\u00f6r HDI<\/th>\t\t\t\t<\/tr>\n\t\t\t<\/thead>\n\t\t\t\t\t\t
Antal lager<\/td>Upp till 24 lager standard. Avancerat 36 lager.<\/td><\/tr>
Tekniska h\u00f6jdpunkter<\/td>High Density Interconnection PCB med laserblindh\u00e5l. POFV, till 4 sekventiella lamineringar (N+4). Avancerad N+6, ELIC 14 lager (X-Via).<\/td><\/tr>
Material<\/td>FR4-r\u00e5material med h\u00f6g TG, l\u00e5g CTE, halogenfri, h\u00f6ghastighets- och l\u00e5gf\u00f6rlustspecifikationer<\/td><\/tr>
Tjocklek p\u00e5 kopparbas<\/td>1\/3 Oz till 2 Oz<\/td><\/tr>
Minsta sp\u00e5r och avst\u00e5nd<\/td>0,075mm \/ 0,075mm, Avancerat 0,075mm \/ 0,05mm<\/td><\/tr>
Tillg\u00e4ngliga ytbehandlingar<\/td>OSP, ENIG, ENEPIG, Soft-Gold, Gold fingers, Immersion Tin, Immersion Silver. Avancerad slective OSP \/ ENIG<\/td><\/tr>
Minsta laserborrning<\/td>0,10 mm. Avancerad 0,05 mm<\/td><\/tr>
Minsta mekaniska borrning<\/td>0,125 mm. Avancerad 0,1mm<\/td><\/tr>
PCB tjocklek<\/td>0.40mm - 3,2mm, Avancerat 5mm.<\/td><\/tr>
Maximala dimensioner<\/td>525x680mm. Avancerad: 980x360mm.<\/td>\t\t\t\t<\/tr>\n\t\t\t<\/tbody>\n\t\t<\/table>\n\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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L\u00e4s mer om HDI<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Webbinarium p\u00e5 beg\u00e4ran<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Om du missade ett webbinarium erbjuder vi nu ett brett utbud av webbinarium p\u00e5 beg\u00e4ran, tillg\u00e4ngliga n\u00e4r som helst!<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t<\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\tBeg\u00e4r detta webbinarium<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"hemodynamic\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Branscher<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Uppt\u00e4ck hur HDI p\u00e5verkar flera olika branscher och flera omr\u00e5den.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Teknologier<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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L\u00e4r dig mer om de olika teknikerna inom kretskortsindustrin och ta reda p\u00e5 vilken som passar dina behov b\u00e4st. <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t<\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\tL\u00e4s mer<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Fr\u00e5gor?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Det finns ett ICAPE Group-team n\u00e4ra dig och ditt f\u00f6retag. V\u00e5ra aff\u00e4rsenheter runt om i v\u00e4rlden \u00e4r bemannade med lokala experter som kan svara p\u00e5 alla dina fr\u00e5gor.<\/p>\n

 Kontakta oss idag! <\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\n\t\t\t\t\tKontakta oss<\/path><\/svg>\t\t\t\t<\/a>\n\t\t\t\t\t<\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

HDI PCBMindre, snabbare, t\u00e4tarer High-Density Interconnect, HDI PCB, anv\u00e4nder mikro-vias och mindre sp\u00e5rutrymme f\u00f6r att ge h\u00f6gre signaldensitet och \u00f6verl\u00e4gsen signalintegritet. Det m\u00f6jligg\u00f6r sammankoppling av paket med l\u00e5g pitch och mycket h\u00f6gre komponentt\u00e4thet. Kontakta oss Direkt offert Produktf\u00f6rdelar HDI f\u00f6rb\u00e4ttrar fan out och minskar l\u00e4ngden p\u00e5 signalv\u00e4gen. HDI tar bort via-stubbar, minskar signalreflexer och f\u00f6rb\u00e4ttrar […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":32408,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-32162","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nHDI PCB | ICAPE Group<\/title>\n<meta name=\"description\" content=\"High-Density Interconnect, HDI PCB, anv\u00e4nder mikro-vias och mindre sp\u00e5rutrymme f\u00f6r att ge h\u00f6gre signaldensitet och \u00f6verl\u00e4gsen signalintegritet.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"HDI PCB | ICAPE Group\" \/>\n<meta name=\"twitter:description\" content=\"High-Density 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