{"id":31582,"date":"2023-04-18T09:42:03","date_gmt":"2023-04-18T09:42:03","guid":{"rendered":"https:\/\/www.icape-group.com\/pcb\/substrato-pcb-ci\/"},"modified":"2025-11-10T21:12:10","modified_gmt":"2025-11-10T21:12:10","slug":"substrato-pcb-ci","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/","title":{"rendered":"Substrato PCB CI"},"content":{"rendered":"\t\t
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Substrato CI
Nova gera\u00e7\u00e3o de PCB ultra HDI<\/span><\/span><\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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O Substrato CI, assim como a PCB (SLP), est\u00e1 ampliando as fronteiras entre a tecnologia HDI PCB e a tecnologia de substrato CI. O SLP \u00e9 uma parte integrada da embalagem ou m\u00f3dulo do CI usado para ligar o chip \u00e0 placa-m\u00e3e PCB. O desenvolvimento da tecnologia SLP \u00e9 principalmente impulsionado pelas ind\u00fastrias dos celulares e dos dispositivos eletr\u00f4nicos port\u00e1teis, sendo um mercado em r\u00e1pido crescimento.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Benef\u00edcios do Produto<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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As principais fun\u00e7\u00f5es da placa de substrato do CI incluem a soldadura de circuitos integrados e a liga\u00e7\u00e3o el\u00e9trica atrav\u00e9s da liga\u00e7\u00e3o de fios ou do processo de flip chip e garante a confiabilidade atrav\u00e9s do uso de mat\u00e9rias-primas adaptadas para o alongamento do chip. A confiabilidade \u00e9 garantida pelo uso de mat\u00e9rias-primas adaptadas ao alongamento dos diferentes materiais durante as fases de montagem e \u00e0s restri\u00e7\u00f5es clim\u00e1ticas.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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\n Alta Densidade <\/h3>\n \t\t \t

O Substrato como PCB (SLP) eleva a produ\u00e7\u00e3o de PCB HDI a um novo n\u00edvel com linhas\/espa\u00e7os ultrafinos at\u00e9 30\/30\u00b5m. Os roteiros comuns dos fabricantes de SLP preveem em atingir a linha\/espa\u00e7o de 20\/20\u00b5m em 2024 e 10\/10 em 2025. \n\n<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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O Substrato como PCB (SLP) \u00e9 baseado em material de resina BT (Triazina de Bismaleimida) em vez de FR4. O material BT tem uma Tg muito alta. 250 a 300 \u00b0C e um CTE X&Y muito baixo 2-5 ppm\/\u00b0C em vez de 11-14 ppm\/\u00b0C para FR4. Isto garante uma integra\u00e7\u00e3o muito confi\u00e1vel com os substratos do CI e cria a possibilidade de criar M\u00f3dulos ou Sistemas em Pacotes (SIP) com chips ou componentes com design de alta densidade.<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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A tecnologia SLP usa materiais de alto desempenho, o processo do substrato do CI e os empilhamentos com vias definidas a laser conhecidos da tecnologia HDI para criar uma PCB HDI muito confi\u00e1vel e ultra complexa.<\/p>\n <\/div>\n \n \n <\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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O que \u00e9 Substrato PCB CI?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Defini\u00e7\u00e3o<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Um Substrato como PCB CI (SLP), tamb\u00e9m conhecida como placa de suporte de circuito integrado, \u00e9 um tipo de placa de circuito impresso especificamente projetada para conter chips de circuitos integrados (CI). \u00c9 uma PCB ultra HDI usada na ind\u00fastria de semicondutores para embalar e ligar chips do CI ao resto do sistema eletr\u00f4nico.<\/p>\n

A principal fun\u00e7\u00e3o de um Substrato PCB CI \u00e9 fornecer uma plataforma f\u00edsica para montar e interligar os chips do CI. A SLP tem normalmente 2-6 camadas de tra\u00e7os condutores, vias definidas por laser e blocos que permitem liga\u00e7\u00f5es el\u00e9tricas entre os chips do CI e a PCB.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Especifica\u00e7\u00f5es<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Linha e espa\u00e7o:<\/strong> 30\/30\u00b5m (avan\u00e7ado 20\/20\u00b5m)<\/p>\n

Vias:<\/strong> 50\u00b5m Definido a Laser.<\/p>\n

Contagem de camadas:<\/strong> 2 a 6<\/p>\n

Material da PCB:<\/strong> Resina BT, Triazina de Bismaleimida<\/p><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Estrutura do Substrato CI<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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H\u00e1 3 m\u00e9todos de processamento diferentes.<\/strong><\/p>


M\u00e9todo subtrativo<\/span><\/strong> \u2013 Um processo subtrativo usando folhas de cobre finas de 9\u201312 \u00b5m e etapas de produ\u00e7\u00e3o baseadas no m\u00e9todo de panel tenting<\/span>. Possibilidade de linha e espa\u00e7o de 35\/35\u00b5m.<\/p>

mSAP<\/strong> \u2013 Um processo semiaditivo modificado: um processo semiaditivo modificado usando uma folha de cobre ultrafina de 1,5 \u00b5m, um revestimento qu\u00edmico de cobre + um revestimento de cobre seletivo e uma grava\u00e7\u00e3o seletiva<\/span>. Possibilidade de linha e espa\u00e7o de 20\/20\u00b5m.<\/p>

SAP<\/strong> \u2013 Processo semiaditivo: um processo semiaditivo usando um material especial sem cobre de base e um revestimento qu\u00edmico de cobre + cobre seletivo e grava\u00e7\u00e3o seletiva<\/span>. Possibilidade de linha e espa\u00e7o de 15\/15\u00b5m. (O m\u00e9todo SAP pode criar at\u00e9 12 camadas, mas s\u00f3 est\u00e1 dispon\u00edvel para produ\u00e7\u00e3o em massa.)<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Empilhamento e material do Substrato CI <\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Pilha semelhante \u00e0s placas de circuito HDI com n\u00facleo e PP.<\/span>
Material de resina BT (Triazina de Bismaleimida) em vez de FR4
A BT tem uma Tg mais alta. 250 a +300 \u00b0C
A BT tem o eixo XY de menor CTE 2-5ppm\/\u00b0C em vez de 11-14ppm\/\u00b0C para FR4.
Limitado a empilhamento 2L, 4L e 6L para padr\u00e3o e 1+2+1, 1+4+1, 2+2+2 para estrutura.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Precisa de PCB de Substrato IC?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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As PCB de Dupla Face e Multicamadas s\u00e3o usadas normalmente em uma s\u00e9rie de aplica\u00e7\u00f5es eletr\u00f4nicas, como telecomunica\u00e7\u00f5es, sistemas de controle industrial e fontes de alimenta\u00e7\u00e3o. S\u00e3o tamb\u00e9m usadas em prot\u00f3tipos e em pequenas s\u00e9ries de produ\u00e7\u00e3o.<\/span><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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As principais marcas do setor Automotivo escolhem o ICAPE para corresponder e exceder as altas exig\u00eancias de qualidade e log\u00edstica de sua ind\u00fastria<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Um n\u00famero cada vez maior de empresas do setor m\u00e9dico confia na Precis\u00e3o do ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Os clientes da ind\u00fastria de consumo e multimidia beneficiam de nossa alta qualidade e de nosso extenso conhecimento de eletr\u00f4nica.<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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O setor da Automa\u00e7\u00e3o Industrial beneficia do conhecimento profundo que o ICAPE tem da complexidade da automa\u00e7\u00e3o e da rob\u00f3tica<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Desde o momento em que a ilumina\u00e7\u00e3o come\u00e7ou a se tornar eletr\u00f4nica, os engenheiros do ICAPE t\u00eam estado na vanguarda dos \u00faltimos desenvolvimentos, apoiando o projeto para produ\u00e7\u00e3o em massa<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Nosso mundo eletrificado prospera gra\u00e7as aos conhecimentos de engenharia do ICAPE, que permitem que as altas tens\u00f5es e correntes transportem nossa energia de forma segura<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Nosso mundo eletrificado prospera gra\u00e7as aos conhecimentos de engenharia do ICAPE, que permitem que as altas tens\u00f5es e correntes transportem nossa energia de forma segura<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Telecomunica\u00e7\u00f5es<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t
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Nosso desejo de ficarmos conectados, sempre e em qualquer lugar, \u00e9 a base do know-how de engenharia e das solu\u00e7\u00f5es completas do ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Ferrovi\u00e1ria<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t
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Os engenheiros e especialistas em cadeias de abastecimento do ICAPE fornecem solu\u00e7\u00f5es para ajudar at\u00e9 mesmo as redes ferrovi\u00e1rias mais densas a se manterem no bom caminho<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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IoT<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t
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Conectar redes inteligentes a solu\u00e7\u00f5es inteligentes atrav\u00e9s do ICAPE<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t\t\t
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Aeroespacial<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\t\t
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O ICAPE Group est\u00e1 crescendo na ind\u00fastria aeroespacial gra\u00e7as \u00e0s vantagens oferecidas por nossos servi\u00e7os especializados e por nossas solu\u00e7\u00f5es completas.<\/div>\n\t\t\t\t\t\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Dados T\u00e9cnicos<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Substrato CI<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Caracter\u00edstica do substrato IC<\/th>Especifica\u00e7\u00e3o t\u00e9cnica do substrato IC do Grupo ICAPE<\/th>\t\t\t\t<\/tr>\n\t\t\t<\/thead>\n\t\t\t\t\t\t
Contagem de camadas<\/td>2 a 6<\/td><\/tr>
Destaques tecnol\u00f3gicos<\/td>O substrato de CI \u00e9 um suporte de PCB para solda de 1 chip pelo processo de colagem de fios ou pelo processo Flip Chip<\/td><\/tr>
Materiais<\/td>BT (Bismaleimida Triazina)<\/td><\/tr>
Espessura do cobre da base<\/td>0-12um, dependendo do m\u00e9todo de estrutura do substrato<\/td><\/tr>
Faixa e espa\u00e7amento m\u00ednimos<\/td>30\/30\u00b5m (avan\u00e7ado 20\/20\u00b5m)<\/td><\/tr>
Acabamentos de superf\u00edcie dispon\u00edveis<\/td>ENIG E ENEPIG<\/td><\/tr>
Perfura\u00e7\u00e3o m\u00ednima a laser<\/td>50\u00b5m<\/td><\/tr>
Perfura\u00e7\u00e3o mec\u00e2nica m\u00ednima<\/td>100\u00b5m<\/td><\/tr>
Espessura da placa de circuito impresso<\/td>2L min. 130\u00b5m, 4L min. 210\u00b5m, 6L min. 300\u00b5m<\/td>\t\t\t\t<\/tr>\n\t\t\t<\/tbody>\n\t\t<\/table>\n\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Tem alguma quest\u00e3o?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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H\u00e1 uma equipe do ICAPE Group perto de voc\u00ea e de sua empresa. Em todo o mundo, nossas unidades empresariais contam com especialistas nativos dispon\u00edveis para responder a todas suas perguntas.<\/p>\n

 Contate-nos hoje!<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\t\t\n\t\t\t\t\tFale conosco<\/path><\/svg>\t\t\t\t<\/a>\n\t\t\t\t\t<\/div>\n <\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Substrato CI Nova gera\u00e7\u00e3o de PCB ultra HDI O Substrato CI, assim como a PCB (SLP), est\u00e1 ampliando as fronteiras entre a tecnologia HDI PCB e a tecnologia de substrato CI. O SLP \u00e9 uma parte integrada da embalagem ou m\u00f3dulo do CI usado para ligar o chip \u00e0 placa-m\u00e3e PCB. O desenvolvimento da tecnologia […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":29762,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-31582","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nSUBSTRATO PCB CI | ICAPE Group<\/title>\n<meta name=\"description\" content=\"As PCB Padr\u00e3o de Dupla Face e Multicamadas s\u00e3o produzidas principalmente em material FR4. O FR4 \u00e9 um material revestido a cobre e refor\u00e7ado com vidro tecido com resina \u00e0 base de ep\u00f3xi.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"SUBSTRATO PCB CI | ICAPE Group\" \/>\n<meta name=\"twitter:description\" content=\"As PCB Padr\u00e3o de Dupla Face e Multicamadas s\u00e3o produzidas principalmente em material FR4. 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O FR4 \u00e9 um material revestido a cobre e refor\u00e7ado com vidro tecido com resina \u00e0 base de ep\u00f3xi.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/pcb\\\/substrato-pcb-ci\\\/#breadcrumb\"},\"inLanguage\":\"pt-PT\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/pcb\\\/substrato-pcb-ci\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"pt-PT\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/pcb\\\/substrato-pcb-ci\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.icape-group.com\\\/wp-content\\\/uploads\\\/2023\\\/04\\\/Better-signal-integrity.png\",\"contentUrl\":\"https:\\\/\\\/www.icape-group.com\\\/wp-content\\\/uploads\\\/2023\\\/04\\\/Better-signal-integrity.png\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/pcb\\\/substrato-pcb-ci\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB\",\"item\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/pcb\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Substrato PCB CI\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/#website\",\"url\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/\",\"name\":\"ICAPE Group\",\"description\":\"The power of precision\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"pt-PT\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/#organization\",\"name\":\"ICAPE Group\",\"url\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"pt-PT\",\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"\",\"contentUrl\":\"\",\"caption\":\"ICAPE Group\"},\"image\":{\"@id\":\"https:\\\/\\\/www.icape-group.com\\\/pt-pt\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"SUBSTRATO PCB CI | ICAPE Group","description":"As PCB Padr\u00e3o de Dupla Face e Multicamadas s\u00e3o produzidas principalmente em material FR4. O FR4 \u00e9 um material revestido a cobre e refor\u00e7ado com vidro tecido com resina \u00e0 base de ep\u00f3xi.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"twitter_card":"summary_large_image","twitter_title":"SUBSTRATO PCB CI | ICAPE Group","twitter_description":"As PCB Padr\u00e3o de Dupla Face e Multicamadas s\u00e3o produzidas principalmente em material FR4. O FR4 \u00e9 um material revestido a cobre e refor\u00e7ado com vidro tecido com resina \u00e0 base de ep\u00f3xi.","twitter_image":"https:\/\/www.icape-group.com\/wp-content\/uploads\/2023\/04\/Better-signal-integrity.png","twitter_misc":{"Tempo estimado de leitura":"8 minutos"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/","url":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/","name":"SUBSTRATO PCB CI | ICAPE Group","isPartOf":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/#primaryimage"},"image":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/#primaryimage"},"thumbnailUrl":"https:\/\/www.icape-group.com\/wp-content\/uploads\/2023\/04\/Better-signal-integrity.png","datePublished":"2023-04-18T09:42:03+00:00","dateModified":"2025-11-10T21:12:10+00:00","description":"As PCB Padr\u00e3o de Dupla Face e Multicamadas s\u00e3o produzidas principalmente em material FR4. O FR4 \u00e9 um material revestido a cobre e refor\u00e7ado com vidro tecido com resina \u00e0 base de ep\u00f3xi.","breadcrumb":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/#breadcrumb"},"inLanguage":"pt-PT","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/"]}]},{"@type":"ImageObject","inLanguage":"pt-PT","@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/#primaryimage","url":"https:\/\/www.icape-group.com\/wp-content\/uploads\/2023\/04\/Better-signal-integrity.png","contentUrl":"https:\/\/www.icape-group.com\/wp-content\/uploads\/2023\/04\/Better-signal-integrity.png"},{"@type":"BreadcrumbList","@id":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/substrato-pcb-ci\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.icape-group.com\/pt-pt\/"},{"@type":"ListItem","position":2,"name":"PCB","item":"https:\/\/www.icape-group.com\/pt-pt\/pcb\/"},{"@type":"ListItem","position":3,"name":"Substrato PCB CI"}]},{"@type":"WebSite","@id":"https:\/\/www.icape-group.com\/pt-pt\/#website","url":"https:\/\/www.icape-group.com\/pt-pt\/","name":"ICAPE Group","description":"The power of precision","publisher":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.icape-group.com\/pt-pt\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"pt-PT"},{"@type":"Organization","@id":"https:\/\/www.icape-group.com\/pt-pt\/#organization","name":"ICAPE Group","url":"https:\/\/www.icape-group.com\/pt-pt\/","logo":{"@type":"ImageObject","inLanguage":"pt-PT","@id":"https:\/\/www.icape-group.com\/pt-pt\/#\/schema\/logo\/image\/","url":"","contentUrl":"","caption":"ICAPE Group"},"image":{"@id":"https:\/\/www.icape-group.com\/pt-pt\/#\/schema\/logo\/image\/"}}]}},"_links":{"self":[{"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/pages\/31582","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/comments?post=31582"}],"version-history":[{"count":21,"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/pages\/31582\/revisions"}],"predecessor-version":[{"id":359813,"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/pages\/31582\/revisions\/359813"}],"up":[{"embeddable":true,"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/pages\/29762"}],"wp:attachment":[{"href":"https:\/\/www.icape-group.com\/pt-pt\/wp-json\/wp\/v2\/media?parent=31582"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}