{"id":31311,"date":"2023-04-04T12:57:16","date_gmt":"2023-04-04T12:57:16","guid":{"rendered":"https:\/\/www.icape-group.com\/camada-interna\/"},"modified":"2024-08-30T14:12:41","modified_gmt":"2024-08-30T14:12:41","slug":"camada-interna","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/pt-pt\/ciencia-das-pcb\/camada-interna\/","title":{"rendered":"Camada Interna"},"content":{"rendered":"\t\t
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Camada Interna<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Percurso PCB 3:<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Camada Interna<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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A capta\u00e7\u00e3o de imagens da camada interna \u00e9 um passo muito t\u00e9cnico do processo que ocorre numa sala limpa e amarela. Por qu\u00ea? Dado que a pel\u00edcula seca \u00e9 sens\u00edvel aos raios UV e para evitar curtos-circuitos e aberturas na camada interior, deve ser atingido um n\u00edvel entre 3.000 e 4.000 part\u00edculas de p\u00f3 por metro c\u00fabico.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - LIMPEZA<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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A sala limpa usa a sobrepress\u00e3o para proteger e remover qualquer poeira proveniente do exterior da sala limpa. Antes de entrarem na sala limpa, os pain\u00e9is s\u00e3o limpos. Consoante a espessura das camadas internas, os processos s\u00e3o diferentes. Para camadas mais finas do que 500 micr\u00f4metros \u00e9 usado o processo qu\u00edmico. Para camadas mais espessas, \u00e9 prefer\u00edvel o processo mec\u00e2nico.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - ENDU\u00c7\u00c3O<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Quando os pain\u00e9is chegam \u00e0 sala limpa, s\u00e3o aquecidos e, em seguida, a pel\u00edcula de photoresist ou a tinta (entre 7 e 11 \u00b5m) \u00e9 automaticamente aplicada no painel.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - REGISTRO E INSOLA\u00c7\u00c3O<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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As placas s\u00e3o registradas a +\/- 15 a 30 micr\u00f4metros com 2 ou 4 C\u00e2maras CCD. \u00c9 criado um v\u00e1cuo e, em seguida, \u00e9 aplicado um jato de luz UV com uma dura\u00e7\u00e3o m\u00e9dia de 1 a 20 segundos, dependendo do processo: isto \u00e9 a insola\u00e7\u00e3o. As placas est\u00e3o polimerizadas e prontas para serem desenvolvidas.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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4 - DESENVOLVIMENTO E GRAVA\u00c7\u00c3O<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Para a fase de desenvolvimento, a placa \u00e9 lavada com uma solu\u00e7\u00e3o alcalina que remove o photoresist n\u00e3o endurecido. A partir da\u00ed, podemos ver a imagem da camada interna pela primeira vez. A grava\u00e7\u00e3o \u00e9 o passo cr\u00edtico na capta\u00e7\u00e3o de imagens de camadas. O cobre n\u00e3o protegido \u00e9 removido e define o padr\u00e3o. Ap\u00f3s a remo\u00e7\u00e3o da tinta, a pel\u00edcula de photoresist \u00e9 agora completamente removida.<\/p><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - INSPE\u00c7\u00c3O \u00d3TICA AUTOM\u00c1TICA (AOI)<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ap\u00f3s a Lamina\u00e7\u00e3o multicamadas, \u00e9 imposs\u00edvel corrigir os erros que ocorrem nas camadas internas. A Inspe\u00e7\u00e3o \u00d3tica Autom\u00e1tica confirmar\u00e1 a aus\u00eancia total de defeitos. O desenho original do arquivo GERBER serve de modelo. Se a m\u00e1quina detectar alguma incoer\u00eancia, um t\u00e9cnico avaliar\u00e1 o problema.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Outras etapas<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Camada Interna Percurso PCB 3: Camada Interna A capta\u00e7\u00e3o de imagens da camada interna \u00e9 um passo muito t\u00e9cnico do processo que ocorre numa sala limpa e amarela. Por qu\u00ea? Dado que a pel\u00edcula seca \u00e9 sens\u00edvel aos raios UV e para evitar curtos-circuitos e aberturas na camada interior, deve ser atingido um n\u00edvel entre […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":29789,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-31311","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nProcesso de fabrica\u00e7\u00e3o | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Os engenheiros do ICAPE Group realizam uma revis\u00e3o do Projeto para a Fabrica\u00e7\u00e3o (DFM), verificam dados, camadas de cobre, desenho mec\u00e2nico, especifica\u00e7\u00f5es...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" 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