ICAPEグループは、1999年以来、アジアの技術コンサルティングおよびプリント基板調達(PCB)に特化しています。 毎年、lCAPEグループは、すべての分野で組織とサービスレベルを開発しています。

ICAPEグループは、その分野における欧州のリーダーとして、発展しています。 また、お客様のニーズにより良いサービスを提供し、システム化するため、市場に応じて適応可能な技術サポートを統合しています。

数か月にわたって、PCBおよび技術部品の分野における技術的および一般的なトレーニングの結果から、現在の市場ニーズを分析し、体系化しました。 私たちはテクニカルデイズで議論された7つのテーマを統合するために、エンジニア、PCBおよびテクニカルパーツの専門家の助けを借り、プログラムを開発しました。


  • シングルサイドとポリマPCB
  • PCB製造プロセス
  • マルチレイヤーとHDI
  • フレキシブルとフレックスリジットPCB
  • CIPEMからの製品
  • 照明と電力
  • デザインコスト




Dates of Technical Days

Date Place
January 27th 2021 Italy
February 2nd 2021 France
February 17th 2021 Seweden
March 2nd 2021 South Africa
March 10th 2021 Denmark
March 23rd 2021 Brasil
April 7th 2021 Spain
April 14th 2021 Finland
April 15th 2021 Germany
April 21st 2021 Italy
May 12th 2021 Thailand
May 18th 2021 Japan
May 20th 2021 Japan
May 27th 2021 Russia
June 22th 2021 Brasil
September 7th 2021 Spain
September 9th 2021 Malaysia
September 15th 2021 Poland
September 21st 2021 Brasil
October 19th 2021 France
October 27th 2021 Germany
November 16th 2021 India



ICAPE-DIVSYS also invites their customers in USA to spend a day with these Technical experts in Printed Circuit Boards and Assembly Processes. The day will feature three 45 minute Technical presentation, Tours, Lunch and snacks, and two workshops.

While the topics are technical in nature, they do not require a technical background. They are intended for participants from all disciplines from Purchasing to Quality.

We expect the workshops to be interactive, and invite customer participation with questions and comments.

We understand the busy schedules of all of our customers, so the presentations and workshops may be attended for the entire day, or just for topics of specific interest.


  • Laminates choices and Proper selection
  • Surface Finishes and their Applications and Limitations
  • Via Structures and their uses
  • Copper plating and Understanding thickness
  • Cleanliness understanding the terms and the implications
  • Why does the bare board and the assembly have the same standard?
  • Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
  • Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
  • Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
  • Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements
  • Cleanliness (ionic contamination, organic contamination and intermetallic growth)
  • Measurement Techniques for cleanliness (Gross Ion Accumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

Dates of Technical Days

Date Place
March 17th 2021 USA
june 16th 2021 USA
September 29th 2021 USA