{"id":31354,"date":"2023-04-04T12:57:16","date_gmt":"2023-04-04T12:57:16","guid":{"rendered":"https:\/\/www.icape-group.com\/strato-interno\/"},"modified":"2024-08-29T19:45:29","modified_gmt":"2024-08-29T19:45:29","slug":"strato-interno","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/it\/scienza-dei-pcb\/strato-interno\/","title":{"rendered":"Strato interno"},"content":{"rendered":"\t\t
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Strato interno<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Viaggio con il PCB 3:<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Strato interno<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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L’imaging dello strato interno \u00e8 una fase molto tecnica del processo, che avviene in una camera gialla e pulita. Perch\u00e9? Poich\u00e9 il film secco \u00e8 sensibile ai raggi UV e per evitare cortocircuiti e aperture sullo strato interno, \u00e8 necessario raggiungere un livello compreso tra 3000 e 4000 particelle di polvere per metro cubo.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - PULIZIA<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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La camera bianca utilizza una sovrapressione per proteggere e rimuovere qualsiasi polvere proveniente dall’esterno della camera bianca. Prima di entrare nella camera bianca, i pannelli vengono puliti. A seconda dello spessore degli strati interni, i processi sono diversi. Per gli strati pi\u00f9 sottili di 500 micrometri, si utilizza il processo chimico. Per gli strati pi\u00f9 spessi, si preferisce il processo meccanico.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - RIVESTIMENTO<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Quando i pannelli arrivano nella camera bianca, vengono riscaldati, quindi il film fotoresistente o l’inchiostro (tra 7 e 11 \u00b5m) viene applicato automaticamente sul pannello.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - REGISTRAZIONE E INSOLAZIONE<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Le schede sono registrate +\/- da 15 a 30 micrometri con 2 o 4 telecamere CCD. Si crea il vuoto, quindi si applica un fascio di luce UV con una durata media da 1 a 20 secondi a seconda del processo: questa \u00e8 l’insolazione. Le schede sono polimerizzate e pronte per essere sviluppate.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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4 - SVILUPPO E INCISIONE<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Per la fase di sviluppo, la scheda viene lavata con una soluzione alcalina che rimuove la fotoresistenza non indurita. Da qui si pu\u00f2 vedere per la prima volta l’immagine del livello interno. L’incisione \u00e8 la fase critica dell’imaging dello strato. Il rame non protetto viene rimosso e definisce il disegno. Dopo aver rimosso l’inchiostro, il film fotoresistente \u00e8 ora completamente rimosso.<\/p><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - ISPEZIONE OTTICA AUTOMATICA (AOI)<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Dopo la laminazione multistrato, \u00e8 impossibile correggere gli errori che si verificano sugli strati interni. L’ispezione ottica automatica confermer\u00e0 la totale assenza di difetti. Il progetto originale del file GERBER funge da modello. Se la macchina rileva delle incongruenze, un tecnico valuter\u00e0 il problema.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Altre fasi<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\t\t\t\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Strato interno Viaggio con il PCB 3: Strato interno L’imaging dello strato interno \u00e8 una fase molto tecnica del processo, che avviene in una camera gialla e pulita. Perch\u00e9? Poich\u00e9 il film secco \u00e8 sensibile ai raggi UV e per evitare cortocircuiti e aperture sullo strato interno, \u00e8 necessario raggiungere un livello compreso tra 3000 […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":29769,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-31354","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nProcesso di produzione | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Gli ingegneri di ICAPE Group effettuano una revisione del Design For Manufacturability (DFM), controllano i dati, gli strati di rame, il disegno meccanico, le specifiche...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta 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