Um programa completo de Dias Técnicos para conhecer placas de circuitos impressos e peças técnicas!


O ICAPE Group tem se especializado em consultoria técnica e de placas de circuitos impressos (PCB) na Ásia desde 1999.. Ano após ano, o ICAPE Group desenvolveu sua organização e seu nível de serviços em todos os campos.

Como líder europeu em seu campo, o ICAPE Group está bem ciente de suas responsabilidades. O ICAPE Group recentemente integrou as necessidades para melhor estruturar o suporte técnico para seus clientes estando de acordo com o mercado atual.

Durante vários meses, analisamos e estruturamos as necessidades do mercado em termos de treinamentos técnicos e gerais no campo das PCB’s e peças técnicas. Nós os sintetizamos em 7 temas-chave / Dias Técnicos e enviamos-os entre nossos engenheiros seniores especialistas em PCB e Peças Técnicas.

Programa

  • PCB Face Simples e Polímero
  • Processos de fabricação de PCB
  • Tecnologias Multicamada e HDI
  • PCB flexível e Flex-rigid
  • Produtos da CIPEM
  • Iluminação e Energia
  • Design

Essas conferências são gratuitas, e serão realizadas no nosso centro de conferências em Fontenay-aux-Roses, ao sul de Paris.

Nosso evento de Dias Técnicos também pode ser realizado em nossas Unidades de Negócios em todo o mundo ou no local de nossos clientes. Em geral, as palestras serão fornecidas em inglês, mas também podem estar em francês, dependendo da audiência.

Se você estiver interessado, envie-nos um e-mail para info@icape-group.com

Dates of Technical Days

Date Place
October 16th 2019 Italy
September 27th 2019 Switzerland
July 9th 2019 France
June 5th 2019 Italy
May 24th 2019 Germany
May 15th 2019 Germany
April 11th 2019 Spain
April 9th 2019 Spain
March 27th and 28th 2019 Poland
March 8th 2019 China
January 22th 2019 Italy
October 16th 2018 France
July 24th 2018 France
March 13th-14th 2018 Slovenia
February 15th 2018 Italy
December 12th 2017 Brittany, France
December 8th 2017 Ile de France, France
October 18th 2017 Loire, France
October 3th 2017 Fontenay-aux-Roses, France
June 20th 2017 Toulouse, France
June 6th 2017 Germany


TechDays2017


TECHNICAL Days in USA

ICAPE-DIVSYS also invites their customers in USA to spend a day with these Technical experts in Printed Circuit Boards and Assembly Processes. The day will feature three 45 minute Technical presentation, Tours, Lunch and snacks, and two workshops.

While the topics are technical in nature, they do not require a technical background. They are intended for participants from all disciplines from Purchasing to Quality.

We expect the workshops to be interactive, and invite customer participation with questions and comments.

We understand the busy schedules of all of our customers, so the presentations and workshops may be attended for the entire day, or just for topics of specific interest.

Program

  • Laminates choices and Proper selection
  • Surface Finishes and their Applications and Limitations
  • Via Structures and their uses
  • Copper plating and Understanding thickness
  • Cleanliness understanding the terms and the implications
  • Why does the bare board and the assembly have the same standard?
  • Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
  • Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
  • Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
  • Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements
  • Cleanliness (ionic contamination, organic contamination and intermetallic growth)
  • Measurement Techniques for cleanliness (Gross Ion Accumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract


Dates of Technical Days

Date Place
June 20th 2019 USA, Indianapolis
june 18th 2019 USA, Los Angeles
October 31th 2018 USA, Indianapolis