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An HDI PCB, or High Density Interconnect PCB is a printed circuit board with a higher circuitry density.
An HDI PCB design usually includes finer lines and spaces, smaller vias and capture pads, and pads with high connection density.
A high density PCB incorporates blind, buried vias and microvias.
ICAPE GROUP offers the best quality of single-sided, double-sided, or multi-layered HDI PCBs.
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Panel Length
PCB Length
Panel Width
PCB Width
Panel Qty
PCB Qty
Length unit
PCB per panel
Layer
Number of step
Finished Cu Inner
Finished Cu Outer
Resin Filling
Copper Filling
Press Fit holes
Half holes
CounterSink holes
Board Thickness
Blind via
Buried via
Pealable soldermask
Laser drilling
Finishing
Materia prima / Tg Value
Impedance control
IPC
Solder Mask
Solder Mask color
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HDI PCB – High Density Interconnect PCB - Technical specification
| Specification | Options |
|---|---|
| Layer | 4L-6L-8L-10L-12L |
| Finished Cu Outer (oz) | 35μm |
| Finished Cu Inner (oz) | 1/3; 1/2; 1; 2; 3 |
| Board Thickness (mm) | 0.8-1.0-1.2 1.6-2.0 |
| Specification | Options |
|---|---|
| Peealable soldeermask | Yes - No |
| Materia prima / Tg Value | FR4 TG170 |
| Number of step | 1 - 2 |
| Resin Filling | 0-1-2-3 Time |
| Specification | Options |
|---|---|
| Half holes | Yes - No |
| Blind via | Yes - No |
| Laser drilling | Yes - No |
| Finishing | OSP-HASL-LF-ENIG 2U Imm Tin-Imm Silver |
| Specification | Options |
|---|---|
| Impedance control | Yes - No |
| Press Fit holes | Yes - No |
| Copper Filling | 0-1-2-3 Time |
| CounterSink holes | Yes - No |