Start quoting, view our price and place your order now to get express delivery of your HDI printed circuit board prototypes.
An HDI PCB, or High Density Interconnect PCB is a printed circuit board with a higher circuitry density.
An HDI PCB design usually includes finer lines and spaces, smaller vias and capture pads, and pads with high connection density.
A high density PCB incorporates blind, buried vias and microvias.
View ICAPE HDI PCB Technical Specification and Capabilities
Delivery unit
Panel Length
PCB Length
Panel Width
PCB Width
Panel Qty
PCB Qty
Length unit
PCB per panel
Layer
Number of step
Finished Cu Outer
Resin Filling
Copper Filling
Press Fit holes
Half holes
CounterSink holes
Board Thickness
Blind via
Buried via
Pealable soldermask
Laser drilling
Finishing
Solder Mask
Solder Mask color
Shipping method
Delivery country
We have a large choice of PCB HDI materials. Please contact us for more information and a quote at marc.simonneau@icape.fr
| Brand Name | Type | Series | TG Value | |
|---|---|---|---|---|
| Brand Name | Type | Series | TG Value |
| Specification | Standard capabilities | Advanced Capabilities |
|---|---|---|
| Layer count | 4 ~ 12 layers | >=14 layers |
| HDI | 1 step, 2 steps | 3 steps or above |
| PCB maximum size | 450 x 600 mm | N/A |
| Raw materials | FR4 TG170 | CTI600, Rogers4350, 370HR |
| Board thickness | 0,6mm to 3,2mm | Other thickness on request |
| Thickness tolerance | T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% | T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8% |
| Outer base Copper thickness | 18um ~ 105um | Other thickness on request |
| Inner base Copper thickness | 18um ~ 105um | Other thickness on request |
| Specification | Standard capabilities | Advanced Capabilities |
|---|---|---|
| Maxinum aspect ratio (PTH) | 10:1 | 15:1 |
| Maxinum aspect ratio (Laser) | 0.8:1 | 1:1 |
| Maxinum aspect ratio (Buried Via) | 8:1 | 10:1 |
| Surface finish | OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver | Hard gold, Flash gold, Hybrid |
| Other surface finish | Peelable mask, Carbon ink | N/A |
| Gold finger | No | Yes |
| Drill bit | 0.25 ~ 6mm | 6mm (Use routing to instead) |
| Laser hole size | 4mils, 5mils, 6mils | Other laser hole sizes on request |
| Specification | Standard capabilities | Advanced Capabilities |
|---|---|---|
| Buried hole size | 8mils, 10mils, 12mils | Other buried hole sizes on request |
| Minimum Width/Space on outer layer | 4/4mil | 3/3mil |
| Minimum Width/Space on inner layer | 3/3mil | 4/4mil |
| Minimum BGA pad size | 12mils | 10mils |
| Impedance | < 50ohms:+/-5ohms, > 50ohms:+/-10% | Other tolerance on request |
| Mininum solder mask bridge | 5mils | Base on copper thickness |
| Minimum hole to hole distance | >= 12mils | >= 10mils ~ < 12mils |
| Minimum buried via pitch | 0.25 mm | 0.2 mm |
