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View ICAPE Rigid PCB Technical Specification and Capabilities
Delivery unit
Panel length
PCB length
Panel width
PCB width
Panel qty
PCB quantity
Length unit
PCB area size :
PCB per panel
X out
Solder Mask
Solder Mask Color
Solder Mask Color type
Outer Copper Base
Via filling material
Extra prepregs
V-scoring
Smallest Drilling Hole Size
Width & Space
IPC
Shipping method
Delivery country
Estimated Delivery DateEstimated delivery date: production time + delivery days
Working days: Monday to Friday (excluding weekends and public holidays)
Delivery date of your PCBs will be confirmed after Engineering Questions are over
(Chinese New Year dependant)
We have a large choice of PCB rigid materials. Please contact us for more information and a quote at iqts@icape-group.com.
Brand Name | Type | Series | TG Value | |
---|---|---|---|---|
EMC | FR-4 | EM827 | 170 | Download specs PDF |
EMC | FR-4 | EM825 | 150 | Download specs PDF |
ITEQ | FR-4 | IT158 | 150 | Download specs PDF |
ITEQ | FR-4 | IT180A | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6167 | 170 | Download specs PDF |
KING BOARD | FR-4 | KB-6165 | 150 | Download specs PDF |
KING BOARD | FR-4 | KB-6160 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1141 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1600 | 130 | Download specs PDF |
SHENG YI | FR-4 | S1000-2M | 170 | Download specs PDF |
SHENG YI | FR-4 | S1000H | 150 | Download specs PDF |
Brand Name | Type | Series | TG Value |
Specification | Standard Capabilities | RFQ on request |
---|---|---|
Technology | Single side to 10 layers | Up to 48 layers |
PCB minimum size by unit | 20 x 20 mm | Same |
PCB minimum size on the routing panel | 10 x 10 mm | Same |
Maximum size | 480 x 580 mm | Other sizes on request |
Maximum area | 50 m2 | > 50m2 on request |
Thickness | 0,8mm to 3,2mm | from 0,2 mm to 3,2 mm |
Thickness tolerance | +/- 10% | +/- 8% |
Outer Copper thickness | 18, 35, 70, 110, 140 µm | Same |
Inner Copper thickness | 17, 35, 70, 105, 140, 175, 210 µm | Higher than 400 µm |
Specification | Standard Capabilities | RFQ on request |
---|---|---|
Raw materials | FR4 TG up to 180°C | High Tg°, Rogers, Arlon, Teflon |
UL approved materials | Yes | Yes |
Finishing | OSP, HASL, LF-HASL, ENIG, Silver, Tin | Same |
Solder mask vias | Yes | Same |
Grooving | Yes | Grooving with jump |
Multilayers special stack up | No | Yes |
Drill diameter | 0.2 to 6.3 mm | < 0.2 mm |
Track and space on inner layers | 100 µm | depend of copper base |
Track and space on outer layers | 100 µm | depend of copper base |
Monitored Impedance | Yes | Yes |
Specification | Standard Capabilities | RFQ on request |
---|---|---|
CTI > 600V | Yes | Yes |
Solder mask | Green, White, Black, Red, Blue, Yellow | Same |
Silkscreen | 1 or 2 sides | Same |
Colors | White, Black, Yellow | Red |
Printed lines minimum width | 0.1 mm | 0.075 mm |
Minimum space between lines | 0.1 mm | 0.075 mm |
Peelable mask | < = 20% of total area | > 20% of total area |
Carbon Silkscreen | Yes | Yes |
Routing | Simple or Complex | Same |
Routing tolerance | +/- 0,2 mm | +/- 0,1 mm |
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