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View ICAPE Aluminium PCB Technical Specification and Capabilities
Menge Liefereinheit
Nutzen Länge
LP Länge
Nutzen Breite
LP Breite
Anzahl Nutzen
Leiterplattenanzahl
Längeneinheit
PCB per panel
X out
Stopplack
Farbe Stopplack
IPC
Kleinster Durchmesser der Vias
Breite & Abstand
V-scoring
Versandmethode
Lieferland
Specification | Standard capabilities | Advanced Capabilities |
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Layer count | SS & DS | 4L & up |
PCB minimum size | 500 x 560 mm | Other sizes on request |
Raw materials | Boyu, Ventec | N/A |
Thermal conductivity | 1W/m-k , 1.5W/m-k, 2W/m-k | >=3W/m-k |
Surface finish | OSP, HASL LF, ENIG, Immersion Tin, Immersion Sliver | N/A |
Specification | Standard capabilities | Advanced Capabilities |
---|---|---|
Metal Thickness | 0.8mm ~ 2.0mm | Other thickness and tolerance on request |
Thickness tolerance | T≤1.0 ± 0.10,others +/- 10% | Other thickness and tolerance on request |
Dielectric thickness | 50µm ~ 150µm | N/A |
Base copper | 18µm, 35µm, 70µm | >=105µm |
Minimum Width/Space | 4/4mils | N/A |
Mininum solder mask bridge | 6mils | Depend on copper foil |
Specification | Standard capabilities | Advanced Capabilities |
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Mininum solder mask clearance | 3mils | Depend on copper foil |
Solder mask | White, Black, Green, Blue, Red, Yellow | N/A |
Silkscreen | White, Black ,Yellow | N/A |
Minimum hole | 1.0mm | >=0.5mm |
Hole Tolerence | +/-0.1mm | N/A |
Routing tolerance | +/-0.2mm | +/-0.15mm |
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Oberseite | Unterseite |
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linker | rechter |
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Nutzentrennung Y
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