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Pedido online HDI PCB

Comece a cotar, veja nosso preço e faça seu pedido agora para obter a entrega expressa de seus protótipos de placa de circuito impresso HDI.
Um HDI PCB ou PCB de interconexão de alta densidade é uma placa de circuito impresso com uma densidade de circuito mais alta.
Um design de PCB HDI geralmente inclui linhas e espaços mais finos, vias menores e pads de captura e pads com alta densidade de conexão.
Um PCB de alta densidade incorpora microvias e vias cegas ocultas.
Ver especificações técnicas e capacidades de PCB ICAPE HDISpecification and Capabilities


Unidade de entrega

Panel Length

Comprimento PCB

Panel Width

Largura do PCB

Panel Qty

PCB Qty

Length unit

PCB per panel

Minimum batch size we may quote online is 0.0025 square meter
Maximum batch size we may quote online is 5 square meter
Minimum PCB size is 10x10mm
Maximum PCB width is 240mm - Maximum PCB length is 780mm

Layer

Number of step

Finished Cu Inner

Finished Cu Outer

Resin Filling

Copper Filling

Press Fit holes

Half holes

CounterSink holes

Board Thickness

Blind via

Buried via


Pealable soldermask

Laser drilling

Finishing


RaW Material / Tg Value i

Impedance control

IPC

Máscara de Solda

Cor da Máscara de Solda


Shipping method

Delivery country


The delivery date of your PCBs will be confirmed after Engineering Questions are over.
Access ICAPE PCB prices and delivery time

Criar conta / Entrar


NOVO para Lojas da ICAPE E CIPEM

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Clientes de Lojas ICAPE OU CIPEM existentes


Currency rate : 1€ = 0.982600$
Currency rate : 1€ = $

▼ PCB HDI - Materials



We have a large choice of PCB HDI materials. Please contact us for more information and a quote at marc.simonneau@icape.fr


Brand Name Type Series TG Value PDF
Brand Name Type Series TG Value PDF

▼ HDI PCB – High Density Interconnect PCB - Technical specification




Especificação Standard capabilities Advanced Capabilities
Layer count 4 ~ 12 layers >=14 layers
HDI 1 step, 2 steps 3 steps or above
PCB maximum size 450 x 600 mm N/A
Raw materials FR4 TG170 CTI600, Rogers4350, 370HR
Board thickness 0,6mm to 3,2mm Other thickness on request
Thickness tolerance T < 1.0mm:+/-0.1mm, T > 1.0mm:+/-10% T < 1.0mm:+/-0.1mm;T > 1.0mm:+/- 8%
Outer base Copper thickness 18um ~ 105um Other thickness on request
Inner base Copper thickness 18um ~ 105um Other thickness on request
Especificação Standard capabilities Advanced Capabilities
Maxinum aspect ratio (PTH) 10:1 15:1
Maxinum aspect ratio (Laser) 0.8:1 1:1
Maxinum aspect ratio (Buried Via) 8:1 10:1
Surface finish OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver Hard gold, Flash gold, Hybrid
Other surface finish Peelable mask, Carbon ink N/A
Gold finger No Yes
Drill bit 0.25 ~ 6mm 6mm (Use routing to instead)
Laser hole size 4mils, 5mils, 6mils Other laser hole sizes on request
Especificação Standard capabilities Advanced Capabilities
Buried hole size 8mils, 10mils, 12mils Other buried hole sizes on request
Minimum Width/Space on outer layer 4/4mil 3/3mil
Minimum Width/Space on inner layer 3/3mil 4/4mil
Minimum BGA pad size 12mils 10mils
Impedance < 50ohms:+/-5ohms, > 50ohms:+/-10% Other tolerance on request
Mininum solder mask bridge 5mils Base on copper thickness
Minimum hole to hole distance >= 12mils >= 10mils ~ < 12mils
Minimum buried via pitch 0.25 mm 0.2 mm