{"id":31370,"date":"2023-04-04T12:59:23","date_gmt":"2023-04-04T12:59:23","guid":{"rendered":"https:\/\/www.icape-group.com\/science-des-circuits-imprimes\/processus-de-fabrication\/cuivre-chimique-et-autocatalytique\/"},"modified":"2024-08-28T20:15:21","modified_gmt":"2024-08-28T20:15:21","slug":"cuivre-chimique-et-autocatalytique","status":"publish","type":"page","link":"https:\/\/www.icape-group.com\/fr\/science-des-circuits-imprimes\/processus-de-fabrication\/cuivre-chimique-et-autocatalytique\/","title":{"rendered":"Cuivre chimique et autocatalytique"},"content":{"rendered":"\t\t
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Cuivre chimique et autocatalytique<\/h1><\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Home<\/a><\/span><\/span><\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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6e \u00e9tape du parcours des circuits imprim\u00e9s :<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Cuivre chimique et autocatalytique<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Le d\u00e9p\u00f4t chimique de cuivre, \u00e9galement appel\u00e9 cuivre autocatalytique, cr\u00e9e la liaison \u00e9lectrique entre la couche interne et la couche externe.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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1 - NETTOYAGE STANDARD<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Avant le d\u00e9p\u00f4t du cuivre chimique, la carte doit \u00eatre propre. Pour le processus standard, les premiers bains nettoient et \u00e9liminent tous les r\u00e9sidus du per\u00e7age.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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2 - NETTOYAGE AU PLASMA<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Pour les produits de haute technologie, un proc\u00e9d\u00e9 au plasma est pr\u00e9f\u00e9rable : capable d’\u00e9liminer les r\u00e9sidus les plus durs, tels que les polyimides, le FR4 \u00e0 temp\u00e9rature de transition vitreuse \u00e9lev\u00e9e, le T\u00e9flon et les mat\u00e9riaux micro-ondes RF. Ce proc\u00e9d\u00e9 optionnel permet d’obtenir un excellent niveau de rugosit\u00e9 et de mouillabilit\u00e9 pour le d\u00e9p\u00f4t chimique du cuivre.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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3 - PLACAGE AU PALLADIUM\n<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Plusieurs traitements chimiques permettent d’obtenir des trous conducteurs : il est possible d’utiliser du cuivre, du palladium, du graphite, du polym\u00e8re, en fonction de la technologie de circuit imprim\u00e9 \u00e0 cr\u00e9er. Les cartes sont immerg\u00e9es dans un bain de palladium, \u00e9galement appel\u00e9 bain d’activation, afin de d\u00e9poser une fine couche de palladium.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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4 - PLACAGE AU CUIVRE<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Constamment en mouvement, les panneaux passent \u00e0 travers le bain afin d’\u00e9liminer les \u00e9ventuelles bulles d’air qui se seraient form\u00e9es \u00e0 l’int\u00e9rieur des trous. Le palladium produit une r\u00e9action chimique, de telle sorte qu’un d\u00e9p\u00f4t de cuivre chimique de 1 \u00e0 3 microm\u00e8tres est attir\u00e9 sur toute la surface du panneau et sur les trous r\u00e9cemment perc\u00e9s.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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5 - CONTR\u00d4LES<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Le contr\u00f4le est effectu\u00e9 \u00e0 la fin de ce processus. Il s’agit principalement d’un test de r\u00e9tro\u00e9clairage pour v\u00e9rifier la porosit\u00e9 et le rev\u00eatement du cuivre.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t

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Autres \u00e9tapes<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\n\t\t\t\t\t\n\t\t\t\t<\/a>\n\t\t\t<\/div>\t\t\t\n\t\t\t<\/div>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Cuivre chimique et autocatalytique 6e \u00e9tape du parcours des circuits imprim\u00e9s : Cuivre chimique et autocatalytique Le d\u00e9p\u00f4t chimique de cuivre, \u00e9galement appel\u00e9 cuivre autocatalytique, cr\u00e9e la liaison \u00e9lectrique entre la couche interne et la couche externe. 1 – NETTOYAGE STANDARD Avant le d\u00e9p\u00f4t du cuivre chimique, la carte doit \u00eatre propre. Pour le processus standard, […]<\/p>\n","protected":false},"author":3,"featured_media":0,"parent":31313,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","inline_featured_image":false,"footnotes":""},"class_list":["post-31370","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"yoast_head":"\nProcessus de fabrication | ICAPE Group<\/title>\n<meta name=\"description\" content=\"Les ing\u00e9nieurs d'ICAPE Group proc\u00e8dent \u00e0 un examen de conception pour la fabrication (DFM), v\u00e9rifient les donn\u00e9es, les couches de cuivre, le dessin technique, les sp\u00e9cifications...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:title\" content=\"Processus de fabrication | ICAPE Group\" \/>\n<meta name=\"twitter:description\" 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