Printed Circuit Board can have many sizes and characteristics. The Back Panel is similar to a personal computer’s motherboard. The Back Panel contains connections slots for expansions board and allows for communications between all connected boards.

They are large and thicker than standard PCBs because of the number of connections, and they need many layers (up to 30) to be stiff enough to support the insertion force to plug the daughter PCB connector in the motherboard (rear panel). Rigid multilayers are the most common technology used to develop back panels but Flex rigid can also be developed in case of special casing solution.

There are two types of back panel systems : active back panel and passive back panel. Active back panels contain the slots as well as the necessary circuitry to manage and control all the communication between the slots. In contrast, passive back panels contain almost no computing circuitry.

INTERCONNECTION

Interconnection means communication between PCBs, high speed signal. Making signal integrity a major element. Signal integrity (SI) ensures that a signal is moved from a point to another with sufficient quality or integrity to allow effective communication.

CAPABILITIES

There is a wide range of raw materials available for Back Panel PCB's, from standart FR4, which is a composite material, medium and high TG, for Glasse Transition Temperature, high speed material, polyimide material, high frequency material or mixed material. For the finishing lead free HAL, Electroless Nickel Immersion Gold or Immersion Tin can be choosen.